SapphirePowerSubsystem
About the SapphirePowerSubsystem PCB
SapphirePowerSubsystem is an open source PCB design by ChrisHayward-dev, published on GitHub. It is a 2-layer board measuring 10.2 × 12.7 mm, with 8 components from 7 distinct parts.
Other key parts include the TPS62150RGTT. By type, the board carries 4 resistors, 1 IC, 1 connector, 1 inductor and 1 capacitor.
From the project
See the LastProduction branch for the most current revision
Main components on the SapphirePowerSubsystem
SapphirePowerSubsystem bill of materials (BOM)
8 components, 7 distinct parts.
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 1 | TPS62150RGTT TPS62150 Texas Instruments | VQFN-16-1EP_3x3mm_P0.5mm_EP1.68x1.68mm_ThermalVias | U101 |
| 1 | Conn_01x03_Male | PinHeader_1x03_P2.54mm_Horizontal | J101 |
| 1 | 74439344022 2.2uH Wurth Elektonik | 74439344022 | L101 |
| 1 | CL10C391JB81PNC 390pF Samsung | C_0603_1608Metric | C102 |
| 2 | CRCW0603100KFKEAC 100K Vishay | R_0603_1608Metric | R101, R102 |
| 1 | CRCW0603562KFKEA 562K Vishay | R_0603_1608Metric | R103 |
| 1 | CRCW0603180KFKEAC 180K Vishay | R_0603_1608Metric | R104 |
SapphirePowerSubsystem design files
The KiCad project lives in the ChrisHayward-dev/SapphireKicad repository on GitHub; these links point at the commit this page was built from.
SapphirePowerSubsystem: common questions
How big is the SapphirePowerSubsystem PCB?
The SapphirePowerSubsystem measures 10.2 × 12.7 mm, has 2 copper layers and is 1.6 mm thick.
How many components are on the SapphirePowerSubsystem?
8 components, from 7 distinct parts. The full bill of materials is listed on this page.
Where can I download the SapphirePowerSubsystem design files?
From the ChrisHayward-dev/SapphireKicad repository on GitHub, which has the KiCad layout and the schematic; the links under Design files point to each one.
Can I use the SapphirePowerSubsystem design in my own project?
The repository has no license, so all rights stay with ChrisHayward-dev. Use it as a reference, and ask the author before reusing the design.
