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WirelessHardware

MalekItani·WirelessHardware·pcb/Device.kicad_pcb

WirelessHardware PCB layout, top view — open source board by MalekItani
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About the WirelessHardware PCB

WirelessHardware is an open source PCB design by MalekItani, published on GitHub under the MIT license. It is a 2-layer board measuring 24 × 24 mm, with 44 components from 29 distinct parts.

Other key parts include the B38G3RGB-10D0003H2U1930, LM3671TLX-3.3/NOPB, LTC4124, MAX17048G+T10 and DRV8837CDSGR. By type, the board carries 13 resistors, 12 capacitors, 9 ICs, 5 connectors, 2 microphones and 1 switch.

It belongs with the iot & wireless designs in this gallery.

From the project

PCB design files for the hardware used in Wireless earbuds for low-cost hearing screening

Schematics: Detailed diagrams of the circuitry used in the wireless earbuds.

PCB layouts: Physical layouts of the printed circuit board used in the wireless earbuds.

Bill of materials: A list of components and materials needed to build the wireless earbuds.

Main components on the WirelessHardware

B38G3RGB-10D0003H2U1930LM3671TLX-3.3/NOPBLTC4124MAX17048G+T10DRV8837CDSGRMC3419ISP1807-LR-RSMAX98357AEWL+T

WirelessHardware bill of materials (BOM)

44 components, 29 distinct parts — part numbers from the project's BOM.

QtyPartRefs
1
B38G3RGB-10D0003H2U1930
B38G3RGB
Harvatek Corporation
U1
1
LM3671TLX-3.3/NOPB
BUCK
Texas Instruments
U2
1
LTC4124
Analog Devices
U3
1
MAX17048G+T10
Analog Devices Inc./Maxim Integrated
U4
2
DRV8837CDSGR
Texas Instruments
U5, U6
1
MC3419
MEMSIC
U7
1
ISP1807-LR-RS
Insight SIP
U8
1
MAX98357AEWL+T
MAX98357A
Analog Devices Inc./Maxim Integrated
U9
1
10118194-0001LF
Amphenol ICC (FCI)
J1
1
FTMH-106-03-L-DV
Samtec
J2
1
BATT_TERM
JST Sales America Inc.
P1
1
M2_TERM
P3
1
M1_TERM
P4
2
ICS-41352
TDK-InvenSense
MK1, MK2
1
450302014072
Wurth Elektronik
S1
1
AS01008MR-3-LW100-R
SPEAKER
PUI Audio, Inc.
SP1
1
2.2U
2.2u
Murata Electronics
L1
7
CL05A104KA5NNNC
100nF
Samsung Electro-Mechanics
C1, C2, C6, C10, C11, C12, C14
1
CL05B223KP5NNNC
NO
Samsung Electro-Mechanics
C3
2
CL10A475KP8NNNC
4.7uF
Samsung Electro-Mechanics
C4, C5
Show 9 more
QtyPartRefs
1
CL10X106MO8NRNC
10uF
Samsung Electro-Mechanics
C7
1
CC0402KRX7R7BB563
NO
YAGEO
C8
2
AC0402JR-0750RL
50R
YAGEO
R1, R3
1
CRGCQ0402F180R
180R
TE Connectivity Passive Product
R2
1
CRGCQ0402F180R
10K
TE Connectivity Passive Product
R4
2
ESR01MZPJ103
10K
Rohm Semiconductor
R5, R7
3
NO
R6, R11, R12
1
CPF0402B100KE1
100K
TE Connectivity Passive Product
R8
3
RMCF0402ZT0R00
0R
Stackpole Electronics Inc
R9, R10, R13

WirelessHardware design files

The KiCad project lives in the MalekItani/WirelessHardware repository on GitHub; these links point at the commit this page was built from.

WirelessHardware: common questions

How big is the WirelessHardware PCB?

The WirelessHardware measures 24 × 24 mm, has 2 copper layers and is 1.6 mm thick.

How many components are on the WirelessHardware?

44 components, from 29 distinct parts, with part numbers taken from the project's own BOM. The full bill of materials is listed on this page.

Where can I download the WirelessHardware design files?

From the MalekItani/WirelessHardware repository on GitHub, which has the KiCad layout, the schematic and the BOM; the links under Design files point to each one.

Can I use the WirelessHardware design in my own project?

Yes, under the terms of its MIT license, which MalekItani chose for the repository.

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