Reflow oven hw
About the Reflow oven hw PCB
Reflow oven hw is an open source NXP PCB design by cnpem-emi, published on GitHub. It is a 2-layer board measuring 160 × 129.8 mm, with 28 components from 21 distinct parts.
Its main chip is the MBED-LPC1768, from the NXP family. Other key parts include the MOC3041M. By type, the board carries 8 resistors, 5 connectors, 5 capacitors, 4 switches, 3 diodes and 2 ICs.
Main components on the Reflow oven hw
Reflow oven hw bill of materials (BOM)
28 components, 21 distinct parts.
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 1 | MBED-LPC1768 | DIPS2286W63P254L5370H300Q40N | IC1 |
| 1 | MOC3041M | DIP-6_W7.62mm_Socket_LongPads | U1 |
| 1 | Pot | PinHeader_1x03_P2.54mm_Vertical | J1 |
| 1 | Display_Nokia5510 | PinHeader_1x08_P2.54mm_Vertical | J2 |
| 1 | Conn | PhoenixContact_MSTBVA_2,5_3-G-5,08_1x03_P5.08mm_Vertical | J3 |
| 1 | Conn_01x03_Male | PhoenixContact_MSTBVA_2,5_3-G-5,08_1x03_P5.08mm_Vertical | J4 |
| 1 | Pins-max6675 | PinHeader_1x05_P2.54mm_Vertical | J5 |
| 1 | XL-007 | Converter_ACDC_XL007 | PS1 |
| 1 | pb1 | SW_Tactile_SKHH_Angled | SW1 |
| 1 | pb2 | SW_Tactile_SKHH_Angled | SW2 |
| 1 | pb3 | SW_Tactile_SKHH_Angled | SW3 |
| 1 | SW_MEC_5G_2LED | P16-BR7-R1 | SW4 |
| 3 | LED | LED_D3.0mm | D2, D3, D4 |
| 4 | 1u | C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | C1, C2, C3, C4 |
| 1 | 100n | C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | C5 |
| 1 | 180 | R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R1 |
| 1 | 360 | R_Axial_DIN0411_L9.9mm_D3.6mm_P20.32mm_Horizontal | R2 |
| 1 | 330 | R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R3 |
| 1 | 69 | R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R4 |
| 3 | 250 | R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R5, R6, R7 |
Show 1 more
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 1 | 1k | R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R8 |
Reflow oven hw design files
The KiCad project lives in the cnpem-emi/reflow-oven-hw repository on GitHub; these links point at the commit this page was built from.
Reflow oven hw: common questions
What microcontroller does the Reflow oven hw use?
The Reflow oven hw is built around the MBED-LPC1768, from the NXP family.
How big is the Reflow oven hw PCB?
The Reflow oven hw measures 160 × 129.8 mm, has 2 copper layers and is 1.6 mm thick.
How many components are on the Reflow oven hw?
28 components, from 21 distinct parts. The full bill of materials is listed on this page.
Where can I download the Reflow oven hw design files?
From the cnpem-emi/reflow-oven-hw repository on GitHub, which has the KiCad layout and the schematic; the links under Design files point to each one.
Can I use the Reflow oven hw design in my own project?
The repository has no license, so all rights stay with cnpem-emi. Use it as a reference, and ask the author before reusing the design.
Can I test firmware for the Reflow oven hw without the hardware?
Yes. HardLabs builds a simulation of the board from its netlist and BOM, so you can run and debug NXP firmware against it before you order a PCB.
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