PCB-reflow solder heat plate
DerSpatz·PCB-reflow-solder-heat-plate·Heatplate_v1.1/Heatplate_v1.1.kicad_pcb
About the PCB-reflow solder heat plate
PCB-reflow solder heat plate is an open source AVR/Arduino PCB design by DerSpatz, published on GitHub under the MIT license. It is a 2-layer board measuring 100 × 100 mm, with 47 components from 24 distinct parts.
Its main chip is the ATMEGA4809-AFR, from the AVR/Arduino family. Other key parts include the AMS1117-5.0. By type, the board carries 15 resistors, 13 capacitors, 4 diodes, 3 transistors, 2 ICs and 2 switches.
It belongs with the sensors and displays & leds designs in this gallery, and the repository also holds 1 earlier revision of it.
From the project
hardware design for a PCB reflow solder heat plate
The PCB reflow solder heat plate can be used to solder small PCBs with SMD parts. The user can control the maximum temperature and heating curve.
The idea for this design comes from https://github.com/AfterEarthLTD/Solder-Reflow-Plate. But when I checked the original design, I found some issues that could cause safety problems and other design choices that are not optimal.

Main components on the PCB-reflow solder heat plate
PCB-reflow solder heat plate bill of materials (BOM)
47 components, 24 distinct parts.
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 1 | ATMEGA4809-AFR | TQFP-48_7x7mm_P0.5mm | U1 |
| 1 | AMS1117-5.0 | SOT-89-3 | U2 |
| 1 | WSP4409A | SOIC-8_3.9x4.9mm_P1.27mm | Q1 |
| 1 | IRLR8726TRPBF | TO-252-2 | Q2 |
| 1 | SS8050 | SOT-23 | Q3 |
| 1 | Barrel_Jack_Switch | BarrelJack_Horizontal | J1 |
| 1 | 5A | Fuse_2920_7451Metric | F1 |
| 2 | SW_Push | SW_PUSH_6mm | SW1, SW2 |
| 1 | LMT85 | TO-92_Inline | TEMP1 |
| 1 | DS18B20Z | SOIC-8_3.9x4.9mm_P1.27mm | TEMP2 |
| 1 | Ext. 1-Wire | PinHeader_1x03_P2.54mm_Vertical | TEMP3 |
| 1 | 1x03_2.54mm | PinHeader_1x03_P2.54mm_Vertical | UPDI1 |
| 1 | RED/GREEN | LED_Avago_PLCC4_3.2x2.8mm_CW | LED1 |
| 1 | SSD1306 | 0.91Inch-OLED-Module | OLED1 |
| 4 | B5819W | D_SOD-123 | D1, D2, D3, D4 |
| 1 | 10u | C_0805_2012Metric | C1 |
| 4 | 680u/16V | CP_Radial_D8.0mm_P3.50mm | C2, C3, C4, C5 |
| 2 | 22u/16V | CP_Elec_4x5.4 | C6, C7 |
| 1 | 470pF | C_0805_2012Metric | C8 |
| 5 | 100nF | C_0805_2012Metric | C9, C10, C11, C12, C13 |
Show 4 more
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 2 | 47 | R_0805_2012Metric | R1, R2 |
| 4 | 1k | R_0805_2012Metric | R3, R5, R6, R7 |
| 4 | 4k7 | R_0805_2012Metric | R4, R8, R9, R10 |
| 5 | 10k | R_0805_2012Metric | R11, R12, R13, R14, R15 |
PCB-reflow solder heat plate design files
The KiCad project lives in the DerSpatz/PCB-reflow-solder-heat-plate repository on GitHub; these links point at the commit this page was built from.
PCB-reflow solder heat plate: common questions
What microcontroller does the PCB-reflow solder heat plate use?
The PCB-reflow solder heat plate is built around the ATMEGA4809-AFR, from the AVR/Arduino family.
How big is the PCB-reflow solder heat plate?
The PCB-reflow solder heat plate measures 100 × 100 mm, has 2 copper layers and is 1.6 mm thick.
How many components are on the PCB-reflow solder heat plate?
47 components, from 24 distinct parts. The full bill of materials is listed on this page.
Where can I download the PCB-reflow solder heat plate design files?
From the DerSpatz/PCB-reflow-solder-heat-plate repository on GitHub, which has the KiCad layout and the schematic; the links under Design files point to each one.
Can I use the PCB-reflow solder heat plate design in my own project?
Yes, under the terms of its MIT license, which DerSpatz chose for the repository.
Can I test firmware for the PCB-reflow solder heat plate without the hardware?
Yes. HardLabs builds a simulation of the board from its netlist and BOM, so you can run and debug AVR/Arduino firmware against it before you order a PCB.
Earlier revisions in the repo: Heatplate_v1.0
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