Acoustic levitation
About the Acoustic levitation PCB
Acoustic levitation is an open source PCB design by leastrobino, published on GitHub under the CERN-OHL-1.2 license. It is a 2-layer board measuring 88 × 88 mm, with 66 components from 12 distinct parts.
Other key parts include the MAX17079GTL+ and TSR2-2450. By type, the board carries 12 capacitors, 10 connectors, 7 ICs and 1 transistor.
From the project
Mirror of GitLab repository, all issues and pull requests should be created there.
An acoustic levitation device designed as a daughterboard for the DE0-Nano-SoC (Terasic Inc.)
[](https://leastrobino.github.io/acoustic-levitation/image1.jpg)[](https://leastrobino.github.io/acoustic-levitation/image2.jpg)[](https://leastrobino.github.io/acoustic-levitation/image3.jpg)[](https://leastrobino.github.io/acoustic-levitation/image4.jpg)
The piezoelectric transducers signals generation is written in VHDL. The phases computation and the G-Code interpreter are written in C and run on embedded Linux. The device controls 88 channels at 40 kHz with a phase resolution of π/625.
Main components on the Acoustic levitation
Acoustic levitation bill of materials (BOM)
66 components, 12 distinct parts — part numbers from the project's BOM.
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 6 | MAX17079GTL+ MAX17079 Maxim Integrated | QFN-40-1EP_6x6mm_Pitch0.5mm_HandSoldering | U1, U2, U3, U4, U5, U6 |
| 1 | TSR2-2450 Traco Power | Traco_TSR2 | U7 |
| 1 | SI3421DV-T1-GE3 Si3421DV Vishay Siliconix | TSOP-6_2.9x1.5mm_Pitch0.95mm | Q1 |
| 1 | SSW-120-03-G-D DE0-Nano-SoC: GPIO 0 Samtec Inc. | Socket_Strip_Straight_2x20_Pitch2.54mm | J1 |
| 1 | SSW-120-03-G-D DE0-Nano-SoC: GPIO 1 Samtec Inc. | Socket_Strip_Straight_2x20_Pitch2.54mm | J2 |
| 1 | 61300811121 DE0-Nano-SoC: JP3 Wurth Electronics Inc. | Pin_Header_Straight_1x08_Pitch2.54mm | J3 |
| 1 | 61301011121 DE0-Nano-SoC: JP2 Wurth Electronics Inc. | Pin_Header_Straight_1x10_Pitch2.54mm | J4 |
| 1 | 61300111121 DE0-Nano-SoC: JP5[3] Wurth Electronics Inc. | Pin_Header_Straight_1x01_Pitch2.54mm | J5 |
| 4 | 8-215079-8 TE Connectivity AMP Connectors | TE_8-215079-8 | J6, J7, J8, J9 |
| 1 | PJ-102AH CUI Inc. | CUI_PJ-102AH | J10 |
| 36 | MA40S4S Murata | Murata_MA40S4S_TE_8134-HC-8P2 | TR1, TR2, TR3, TR4, TR5, TR6, TR7, TR8 +28 |
| 12 | 885012207072 100n Wurth Electronics Inc. | C_0805_HandSoldering | C1, C2, C3, C4, C5, C6, C7, C8 +4 |
Acoustic levitation design files
The KiCad project lives in the leastrobino/acoustic-levitation repository on GitHub; these links point at the commit this page was built from.
Acoustic levitation: common questions
How big is the Acoustic levitation PCB?
The Acoustic levitation measures 88 × 88 mm, has 2 copper layers and is 1.55 mm thick.
How many components are on the Acoustic levitation?
66 components, from 12 distinct parts, with part numbers taken from the project's own BOM. The full bill of materials is listed on this page.
Where can I download the Acoustic levitation design files?
From the leastrobino/acoustic-levitation repository on GitHub, which has the KiCad layout and the BOM; the links under Design files point to each one.
Can I use the Acoustic levitation design in my own project?
Yes, under the terms of its CERN-OHL-1.2 license, which leastrobino chose for the repository.
