Boost
lohhaoyuan·open·power/boost/boost.kicad_pcb
About the Boost PCB
Boost is an open source PCB design by lohhaoyuan, published on GitHub under the MIT license. It is a 2-layer board measuring 72.7 × 33.9 mm, with 22 components from 18 distinct parts.
It belongs with the robotics & motion designs in this gallery.
From the project
Design files for our Robocup Junior Soccer Open robots
Boost bill of materials (BOM)
22 components, 18 distinct parts.
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 2 | Conn_02x03_Counter_Clockwise | PinSocket_2x03_P2.54mm_Vertical | J1, J2 |
| 2 | 0u1 | cap0603 | BC1, BC3 |
| 1 | 100u | CP_Elec_8x6.5 | BC2 |
| 1 | 1u | cap0603 | BC4 |
| 1 | SS510 | SMA (DO-214AC) | BD1 |
| 1 | LM2587S-ADJ/NOPB LM2587S-ADJ | TO170P1435X465-6N | BIC1 |
| 2 | XT30 | AMASS_XT30PW-F_1x02_P2.50mm_Horizontal | BJ1, BSJ1 |
| 1 | 68uH | 1040 One Piece Inductor | BL1 |
| 1 | 57K | res0603 | BR1 |
| 1 | 2k94 | res0603 | BR2 |
| 1 | 1K5 | res0603 | BR3 |
| 1 | 0.1u | res0603 | BSC1 |
| 1 | 1n5 | cap0603 | BSC2 |
| 1 | 1N5401 | D_DO-201AD_P15.24mm_Horizontal | BSD1 |
| 1 | ISC011N06LM5ATMA1 | 8-DFN (5x6) | BSQ1 |
| 1 | 20R | res0603 | BSR1 |
| 2 | 100 | res0603 | BSR2, BSR3 |
| 1 | NCP81074AMNTBG | SOIC-8_3.9x4.9mm_P1.27mm | BSU1 |
Boost design files
The KiCad project lives in the lohhaoyuan/open repository on GitHub; these links point at the commit this page was built from.
- Layoutpower/boost/boost.kicad_pcb
- Schematicpower/boost/boost.kicad_sch
Boost: common questions
How big is the Boost PCB?
The Boost measures 72.7 × 33.9 mm, has 2 copper layers and is 1.6 mm thick.
How many components are on the Boost?
22 components, from 18 distinct parts. The full bill of materials is listed on this page.
Where can I download the Boost design files?
From the lohhaoyuan/open repository on GitHub, which has the KiCad layout and the schematic; the links under Design files point to each one.
Can I use the Boost design in my own project?
Yes, under the terms of its MIT license, which lohhaoyuan chose for the repository.
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