Buck
lohhaoyuan·open·power/buck/buck.kicad_pcb
About the Buck PCB
Buck is an open source PCB design by lohhaoyuan, published on GitHub under the MIT license. It is a 2-layer board measuring 72.7 × 33.9 mm, with 21 components from 15 distinct parts.
Other key parts include the OKL-T6-W12P-C. By type, the board carries 11 connectors, 6 resistors, 2 ICs and 2 capacitors.
It belongs with the robotics & motion and power & battery designs in this gallery.
From the project
Design files for our Robocup Junior Soccer Open robots
Main components on the Buck
Buck bill of materials (BOM)
21 components, 15 distinct parts.
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 2 | OKL-T6-W12P-C | MURATA_OKL-T-6-W12 | U1, U2 |
| 1 | 12V | PinSocket_2x03_P2.54mm_Vertical | J1 |
| 1 | GND | PinSocket_2x03_P2.54mm_Vertical | J2 |
| 1 | VBAT | xt60-f | J3 |
| 1 | Motor | xt30-f | J4 |
| 1 | Drib A | xt30-f | J5 |
| 1 | Drib B | xt30-f | J6 |
| 2 | L1 | JST_XH_B2B-XH-A_1x02_P2.50mm_Vertical | J7, J9 |
| 2 | SPARE | JST_XH_B2B-XH-A_1x02_P2.50mm_Vertical | J8, J10 |
| 1 | Conn_01x05 | JST_XH_B5B-XH-A_1x05_P2.50mm_Vertical | J11 |
| 2 | 10u | cap0603 | C1, C2 |
| 3 | 1K | res0603 | R1, R2, R3 |
| 1 | 330 | res0603 | R4 |
| 1 | 180 | res0603 | R5 |
| 1 | 10 | res0603 | R6 |
Buck design files
The KiCad project lives in the lohhaoyuan/open repository on GitHub; these links point at the commit this page was built from.
- Layoutpower/buck/buck.kicad_pcb
- Schematicpower/buck/buck.kicad_sch
Buck: common questions
How big is the Buck PCB?
The Buck measures 72.7 × 33.9 mm, has 2 copper layers and is 1.6 mm thick.
How many components are on the Buck?
21 components, from 15 distinct parts. The full bill of materials is listed on this page.
Where can I download the Buck design files?
From the lohhaoyuan/open repository on GitHub, which has the KiCad layout and the schematic; the links under Design files point to each one.
Can I use the Buck design in my own project?
Yes, under the terms of its MIT license, which lohhaoyuan chose for the repository.
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