Network-Goblin-ND-2
About the Network-Goblin-ND-2 PCB
Network-Goblin-ND-2 is an open source PCB design by MostlyWithinSpec, published on GitHub under the MIT license. It is a 4-layer board measuring 70 × 30 mm, with 90 components from 28 distinct parts.
Other key parts include the LAN7801-I/9JX, 88E1512-A0-NNP2C000, TLV62569DBVR, 93AA66/SN and TPD4EUSB30DQAR. By type, the board carries 51 capacitors, 26 resistors, 6 ICs, 3 inductors, 2 crystals and 2 connectors.
From the project
A Linux-powered handheld network multitool with real cable diagnostics.
A small USB 3 → Gigabit Ethernet dongle that is just the ND-2 test-port circuit: Microchip LAN7801 (USB 3 to RGMII MAC) + Marvell 88E1512 (GbE PHY with VCT/TDR) + HanRun 1G magjack. Plug it into a Pi 5 / CM5 IO board and prove ethtool --cable-test / --cable-test-tdr before building the CM5 carrier.
Status: ERC and DRC clean, schematic/PCB parity clean, ordered from JLCPCB in Sept 2026. Not yet tested on real hardware. Bring-up plan: docs/bring-up.md.
Main components on the Network-Goblin-ND-2
Network-Goblin-ND-2 bill of materials (BOM)
90 components, 28 distinct parts — part numbers from the project's BOM.
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 1 | LAN7801-I/9JX Microchip | LAN7801_QFN-64-1EP_9x9mm_P0.5mm_EP6.1mm | U1 |
| 1 | 88E1512-A0-NNP2C000 Marvell | 88E1512_QFN-56-1EP_8x8mm_P0.5mm_EP4.4mm | U2 |
| 1 | TLV62569DBVR TLV62569DBV TI | SOT-23-5 | U3 |
| 1 | 93AA66/SN Microchip | SOIC-8_3.9x4.9mm_P1.27mm | U4 |
| 1 | TPD4EUSB30DQAR TPD4EUSB30 TI | USON-10_2.5x1.0mm_P0.5mm | U5 |
| 1 | PRTR5V0U2X,215 PRTR5V0U2X Nexperia | SOT-143 | U6 |
| 2 | X322525MOB4SI 25MHz YXC | Crystal_SMD_3225-4Pin_3.2x2.5mm | Y1, Y2 |
| 1 | HC-USB3.0-C26 Hong Cheng | USB3_A_Plug_HongCheng_HC-USB3.0-C26 | J1 |
| 1 | HR911130C HanRun | RJ45_HanRun_HR911130C_Horizontal | J2 |
| 1 | MPZ2012S601AT000 600R TDK | L_0805_2012Metric | FB1 |
| 1 | SMNR4020-2.2UH 2.2uH Shun Xiang Nuo | L_4.0x4.0mm_SMNR4020 | L1 |
| 1 | SMNR3015-3R3MT 3.3uH Shun Xiang Nuo | L_3.0x3.0mm_SMNR3015 | L2 |
| 6 | CL21A106KAYNNNE 10uF Samsung | C_0805_2012Metric | C1, C5, C21, C35, C42, C48 |
| 33 | CL05B104KO5NNNC 100nF Samsung | C_0402_1005Metric | C2, C3, C4, C11, C12, C15, C16, C17 +25 |
| 3 | CL21A226MAQNNNE 22uF Samsung | C_0805_2012Metric | C6, C7, C13 |
| 4 | 0402CG150J500NT 15pF FH | C_0402_1005Metric | C8, C9, C32, C33 |
| 4 | CL05A105KA5NQNC 1uF Samsung | C_0402_1005Metric | C10, C14, C20, C22 |
| 1 | CL05B224KO5NNNC 220nF Samsung | C_0402_1005Metric | C34 |
| 1 | 0402WGF4533TCE 453k UNI-ROYAL | R_0402_1005Metric | R1 |
| 1 | 0402WGF1003TCE 100k UNI-ROYAL | R_0402_1005Metric | R2 |
Show 8 more
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 1 | 0402WGF1202TCE 12k UNI-ROYAL | R_0402_1005Metric | R3 |
| 1 | 0402WGF2001TCE 2k UNI-ROYAL | R_0402_1005Metric | R4 |
| 5 | 0402WGF1002TCE 10k UNI-ROYAL | R_0402_1005Metric | R5, R6, R8, R22, R23 |
| 1 | 0402WGF0000TCE 0R UNI-ROYAL | R_0402_1005Metric | R7 |
| 12 | 0402WGF220JTCE 22R UNI-ROYAL | R_0402_1005Metric | R9, R10, R11, R12, R13, R14, R15, R16 +4 |
| 1 | 0402WGF1501TCE 1.5k UNI-ROYAL | R_0402_1005Metric | R21 |
| 1 | 0402WGF4991TCE 4.99k UNI-ROYAL | R_0402_1005Metric | R24 |
| 2 | 0402WGF3300TCE 330R UNI-ROYAL | R_0402_1005Metric | R25, R26 |
Network-Goblin-ND-2 design files
The KiCad project lives in the MostlyWithinSpec/Network-Goblin-ND-2 repository on GitHub; these links point at the commit this page was built from.
Network-Goblin-ND-2: common questions
How big is the Network-Goblin-ND-2 PCB?
The Network-Goblin-ND-2 measures 70 × 30 mm, has 4 copper layers and is 1.6 mm thick.
How many components are on the Network-Goblin-ND-2?
90 components, from 28 distinct parts, with part numbers taken from the project's own BOM. The full bill of materials is listed on this page.
Where can I download the Network-Goblin-ND-2 design files?
From the MostlyWithinSpec/Network-Goblin-ND-2 repository on GitHub, which has the KiCad layout, the schematic and the BOM; the links under Design files point to each one.
Can I use the Network-Goblin-ND-2 design in my own project?
Yes, under the terms of its MIT license, which MostlyWithinSpec chose for the repository.