OpenCAPI Breakout
About the OpenCAPI Breakout
OpenCAPI Breakout is an open source PCB design by mwrnd, published on GitHub under the BSD-2-Clause license. It is a 4-layer board measuring 50 × 71 mm, with 36 components from 36 distinct parts.
It belongs with the dev boards & breakouts designs in this gallery.
From the project
OpenCAPI Breakout to U.FL/UMCC
OpenCAPI to U.FL/UMCC Connector breakout.
I have successfully tested the board using 3M 8ES8-1DF21(Datasheet) and SlimSAS SFF-8654 8i 85-Ohm(Archived) cables. The 3M Cable has better performance.
No consideration was given to pinout compatibility with the SlimSAS SFF-8654 Standard.
The Open Coherant Accelerator Processor Interface (OpenCAPI) was a standard that had FPGA-based Advanced Accelerated Cable (AAC) Add-In cards such as ADM-PCIE-9H3, ADM-PCIE-9H7, ADM-PCIE-9V3, ADM-PCIE-9V5, BittWare XUPSVH, BittWare XUP-VV4, BittWare XUP-VVH, and Nvidia Innova-2 Flex.
OpenCAPI Breakout bill of materials (BOM)
36 components, 36 distinct parts.
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 1 | OpenCAPI_AAC_Host | SlimSAS_8x_RA_U10-A474 | J1 |
| 1 | Conn_01x05 | PinSocket_1x05_P2.54mm_Vertical | J2 |
| 1 | Tx0_P | U.FL_Hirose_w_Label | J3 |
| 1 | Tx0_N | U.FL_Hirose_w_Label | J4 |
| 1 | Tx1_P | U.FL_Hirose_w_Label | J5 |
| 1 | Tx1_N | U.FL_Hirose_w_Label | J6 |
| 1 | Tx2_P | U.FL_Hirose_w_Label | J7 |
| 1 | Tx2_N | U.FL_Hirose_w_Label | J8 |
| 1 | Tx3_P | U.FL_Hirose_w_Label | J9 |
| 1 | Tx3_N | U.FL_Hirose_w_Label | J10 |
| 1 | Tx4_P | U.FL_Hirose_w_Label | J11 |
| 1 | Tx4_N | U.FL_Hirose_w_Label | J12 |
| 1 | Tx5_P | U.FL_Hirose_w_Label | J13 |
| 1 | Tx5_N | U.FL_Hirose_w_Label | J14 |
| 1 | Tx6_P | U.FL_Hirose_w_Label | J15 |
| 1 | Tx6_N | U.FL_Hirose_w_Label | J16 |
| 1 | Tx7_P | U.FL_Hirose_w_Label | J17 |
| 1 | Tx7_N | U.FL_Hirose_w_Label | J18 |
| 1 | Rx0_P | U.FL_Hirose_w_Label | J19 |
| 1 | Rx0_N | U.FL_Hirose_w_Label | J20 |
Show 16 more
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 1 | Rx1_P | U.FL_Hirose_w_Label | J21 |
| 1 | Rx1_N | U.FL_Hirose_w_Label | J22 |
| 1 | Rx2_P | U.FL_Hirose_w_Label | J23 |
| 1 | Rx2_N | U.FL_Hirose_w_Label | J24 |
| 1 | Rx3_P | U.FL_Hirose_w_Label | J25 |
| 1 | Rx3_N | U.FL_Hirose_w_Label | J26 |
| 1 | Rx4_P | U.FL_Hirose_w_Label | J27 |
| 1 | Rx4_N | U.FL_Hirose_w_Label | J28 |
| 1 | Rx5_P | U.FL_Hirose_w_Label | J29 |
| 1 | Rx5_N | U.FL_Hirose_w_Label | J30 |
| 1 | Rx6_P | U.FL_Hirose_w_Label | J31 |
| 1 | Rx6_N | U.FL_Hirose_w_Label | J32 |
| 1 | Rx7_P | U.FL_Hirose_w_Label | J33 |
| 1 | Rx7_N | U.FL_Hirose_w_Label | J34 |
| 1 | CLK_P | U.FL_Hirose_w_Label | J35 |
| 1 | CLK_N | U.FL_Hirose_w_Label | J36 |
OpenCAPI Breakout design files
The KiCad project lives in the mwrnd/OpenCAPI_Breakout repository on GitHub; these links point at the commit this page was built from.
- LayoutOpenCAPI_Breakout.kicad_pcb
- SchematicOpenCAPI_Breakout.kicad_sch
OpenCAPI Breakout: common questions
How big is the OpenCAPI Breakout?
The OpenCAPI Breakout measures 50 × 71 mm, has 4 copper layers and is 1.6062 mm thick.
How many components are on the OpenCAPI Breakout?
36 components, from 36 distinct parts. The full bill of materials is listed on this page.
Where can I download the OpenCAPI Breakout design files?
From the mwrnd/OpenCAPI_Breakout repository on GitHub, which has the KiCad layout and the schematic; the links under Design files point to each one.
Can I use the OpenCAPI Breakout design in my own project?
Yes, under the terms of its BSD-2-Clause license, which mwrnd chose for the repository.
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