QSFP Breakout
About the QSFP Breakout
QSFP Breakout is an open source PCB design by mwrnd, published on GitHub under the BSD-2-Clause license. It is a 4-layer board measuring 70 × 47.5 mm, with 54 components from 34 distinct parts.
Other key parts include the QSFP_Conn, TPS562201 and PCA9554A. By type, the board carries 19 connectors, 17 capacitors, 10 resistors, 4 inductors, 3 ICs and 1 diode.
It belongs with the dev boards & breakouts designs in this gallery.
From the project
QSFP Breakout to U.FL/UMCC
Work-In-Progress: Design not yet fully tested.
Additional I2C circuitry is due to this being a stepping stone project for an OpenCAPI to dual QSFP design. OpenCAPI has only a single I2C interface.
All differential signals are length-matched to within 1mm of a 25mm total length, both inter-pair and intra-pair.
A second revision will be needed as the QSFP Cage Mounting pads are incorrect.
Main components on the QSFP Breakout
QSFP Breakout bill of materials (BOM)
54 components, 34 distinct parts.
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 1 | QSFP_Conn | QSFP_Conn_w_Cage | U1 |
| 1 | TPS562201 | SOT-23-6 | U2 |
| 1 | PCA9554A | TSSOP-16_4.4x5mm_P0.65mm | U3 |
| 1 | PCIe_6Pin | ATX_PCIe_6-Pin_Power_Board-Edge | J1 |
| 1 | Control | PinSocket_2x05_P2.54mm_Vertical | J2 |
| 1 | IO_EXP | PinSocket_2x05_P2.54mm_Vertical | J3 |
| 1 | RX1_P | U.FL_Hirose_w_Label | J4 |
| 1 | RX2_N | U.FL_Hirose_w_Label | J5 |
| 1 | RX2_P | U.FL_Hirose_w_Label | J6 |
| 1 | RX3_N | U.FL_Hirose_w_Label | J7 |
| 1 | RX3_P | U.FL_Hirose_w_Label | J8 |
| 1 | RX4_N | U.FL_Hirose_w_Label | J9 |
| 1 | RX4_P | U.FL_Hirose_w_Label | J10 |
| 1 | TX1_N | U.FL_Hirose_w_Label | J11 |
| 1 | TX1_P | U.FL_Hirose_w_Label | J12 |
| 1 | TX2_N | U.FL_Hirose_w_Label | J13 |
| 1 | TX2_P | U.FL_Hirose_w_Label | J14 |
| 1 | TX3_N | U.FL_Hirose_w_Label | J15 |
| 1 | TX3_P | U.FL_Hirose_w_Label | J16 |
| 1 | TX4_N | U.FL_Hirose_w_Label | J17 |
Show 14 more
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 1 | TX4_P | U.FL_Hirose_w_Label | J18 |
| 1 | RX1_N | U.FL_Hirose_w_Label | J19 |
| 1 | POWERED | D_0603_1608Metric_Pad1.05x0.95mm_HandSolder | D1 |
| 1 | 3u3 | L_Bourns-SRN8040_8x8.15mm | L1 |
| 3 | 1uH | L_0805_2012Metric_Pad1.15x1.40mm_HandSolder | L2, L3, L4 |
| 6 | 22u | C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | C1, C2, C3, C4, C5, C6 |
| 2 | 10u | C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | C7, C8 |
| 1 | DNP | C_0603_1608Metric_Pad1.08x0.95mm_HandSolder | C9 |
| 8 | 0u1 | C_0603_1608Metric_Pad1.08x0.95mm_HandSolder | C10, C11, C12, C13, C14, C15, C16, C17 |
| 1 | 33k2 | R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R1 |
| 3 | 10k | R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R2, R3, R4 |
| 3 | 500 | R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R5, R6, R7 |
| 2 | 4k7 | R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R8, R9 |
| 1 | DNP | R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R10 |
QSFP Breakout design files
The KiCad project lives in the mwrnd/QSFP_Breakout repository on GitHub; these links point at the commit this page was built from.
- LayoutQSFP_Breakout.kicad_pcb
- SchematicQSFP_Breakout.kicad_sch
QSFP Breakout: common questions
How big is the QSFP Breakout?
The QSFP Breakout measures 70 × 47.5 mm, has 4 copper layers and is 1.6062 mm thick.
How many components are on the QSFP Breakout?
54 components, from 34 distinct parts. The full bill of materials is listed on this page.
Where can I download the QSFP Breakout design files?
From the mwrnd/QSFP_Breakout repository on GitHub, which has the KiCad layout and the schematic; the links under Design files point to each one.
Can I use the QSFP Breakout design in my own project?
Yes, under the terms of its BSD-2-Clause license, which mwrnd chose for the repository.
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