Backpack

osrf·ovc·ovc3/hardware/ovc3a/ovc3a/backpack/backpack.kicad_pcb

Top view of the Backpack PCB
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Backpack is an open source PCB design by osrf: a 4-layer, 138 × 50 mm board with 54 components (25 distinct parts). It is built around the VN-100, ISOW7842DWER, MAX3221EIPWR, SN74AXCH8T245PWR and more.

the Open Vision Computer

The idea for OVC3 is to dramatically reduce costs from OVC2 by using a mass-produced high-density module for the FPGA/SoC, RAM, and so on. Ideally this module will contain a Zynq UltraScale+ SoC with I/O that can function as a USB3 transceiver.

Some candidate modules: Trenz TE0820 (40mm x 50mm) Trenz TE0803 / TE0808 (52mm x 76mm) UltraZed Enclustra Mercury

For the smallest front cross-sectional area, it would be necessary to keep the "sensor" and "compute" portions on separate boards. Unfortunately, this would also increase small-quantity production costs.

Built around

Parts list

54 components, 25 distinct parts — part numbers from the project's BOM.

QtyPartRefs
1
VN-100
DNP
U1
2
ISOW7842DWER
ISOW7842
Texas Instruments
U2, U3
1
MAX3221EIPWR
MAX3221E
Texas Instruments
U4
2
SN74AXCH8T245PWR
SN74AXCH8T245
Texas Instruments
U5, U6
1
SN74AVCH2T45DCUT
SN74AVCH2T45
Texas Instruments
U7
1
FT230XS-R
FT230XS
FTDI
U8
1
uIMU-2
DNP
U9
1
WM15144
GPIO1
Molex
J1
1
20021111-00030T4LF
TO_CAMERA
Amphenol/FCI
J2
1
ROOT CONSOLE
DNP
J3
1
WM15142
RS232
Molex
J4
1
629105150521
USB_B_Micro
Wurth
J5
1
IMU_UART2
DNP
J6
1
IMU_UART0
DNP
J7
1
debug
DNP
J8
1
debug
DNP
J9
1
LTST-C191KRKT
RXLED
Lite-On
D1
1
LTST-C191KGKT
TXLED
Lite-On
D2
2
BLM18KG601SN1D
ferrite
Murata
FB1, FB2
5
GRM188R61A106KE69D
10u
Murata
C1, C4, C5, C8, C23
Show 5 more
QtyPartRefs
19
CL10B104KO8NNNC
100n
Samsung
C2, C3, C6, C7, C9, C10, C11, C12 +11
2
GCM1885C2A470JA16D
47p
Murata
C20, C22
2
RC0603FR-0727RL
27R
Yageo
R1, R2
2
RC0603FR-07270RL
270R
Yageo
R3, R4
2
RC0603FR-0710KL
10k
Yageo
R5, R6

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