Merged17

pentolope·PCB_MicrophoneArrayV2·generated/route/merged17.kicad_pcb

Merged17 PCB layout, top view — open source board by pentolope

About the Merged17 PCB

Merged17 is an open source PCB design by pentolope, published on GitHub. It is a 4-layer board measuring 120 × 120 mm, with 103 components from 18 distinct parts.

Other key parts include the LP5907MFX-3.3/NOPB, SN74LVC244APWR and USBLC6-4SC6. By type, the board carries 16 microphones, 9 capacitors, 4 ICs, 2 resistors, 1 crystal and 1 fuse.

From the project

A 120 mm circular, four-layer KiCad 10 carrier for sixteen MSM261DHP006 PDM MEMS microphones running at 3.3 V. A socketed Sipeed Tang Nano 9K performs acquisition and decimation; a 2012 Raspberry Pi Model B collects the audio over SPI0 over a 26-way cable to the Pi's P1 header.

A 120 mm circular, four-layer KiCad 10 carrier for sixteen MSM261DHP006 PDM MEMS microphones running at 3.3 V. A socketed Sipeed Tang Nano 9K performs acquisition and decimation; a 2012 Raspberry Pi Model B collects the audio over SPI0 over a 26-way cable to the Pi's P1 header.

The sixteen acoustic ports sit on a 54.00 mm radius at 22.5 degree intervals, channel 0 on +X, numbered counter-clockwise viewed from the component side.

Merged17, from the project README
From the project README

Main components on the Merged17

Merged17 bill of materials (BOM)

103 components, 18 distinct parts — part numbers from the project's BOM.

QtyPartRefs
1
LP5907MFX-3.3/NOPB
LP5907MFX-3.3
Texas Instruments
U1
1
SN74LVC244APWR
SN74LVC244A
Texas Instruments
U2
2
USBLC6-4SC6
STMicroelectronics
U3, U4
1
OT322524.576MJBA4SL
24.576MHz
YXC
X1
4
CL21A106KAYNNNE
10uF
Samsung
CB1, CB2, CB3, CB4
16
CL05B104KO5NNNC
100nF
Samsung
CM1, CM2, CM3, CM4, CM5, CM6, CM7, CM8 +8
1
JK-MSMD050-30
500mA
Jinrui
F1
16
MSM261DHP006
MEMSensing
MK1, MK2, MK3, MK4, MK5, MK6, MK7, MK8 +8
16
0402WGF330JTCE
33R
UNI-ROYAL
RC1, RC2, RC3, RC4, RC5, RC6, RC7, RC8 +8
16
0402WGF220JTCE
22R
UNI-ROYAL
RD1, RD2, RD3, RD4, RD5, RD6, RD7, RD8 +8
16
0402WGF1000TCE
100R
UNI-ROYAL
RV1, RV2, RV3, RV4, RV5, RV6, RV7, RV8 +8
1
SS14
MDD
D1
1
GZ2012D601TF
600R@100MHz
Sunlord
FB1
4
CC0603KRX7R8BB105
1uF
YAGEO
C1, C2, C7, C9
1
CL21A106KAYNNNE
10uF
Samsung
C3
1
C2012X5R1C226KT000E
22uF
TDK
C4
3
CL05B104KO5NNNC
100nF
Samsung
C5, C6, C8
2
0402WGF330JTCE
33R
UNI-ROYAL
R1, R2

Merged17 design files

The KiCad project lives in the pentolope/PCB_MicrophoneArrayV2 repository on GitHub; these links point at the commit this page was built from.

Merged17: common questions

How big is the Merged17 PCB?

The Merged17 measures 120 × 120 mm, has 4 copper layers and is 1.6 mm thick.

How many components are on the Merged17?

103 components, from 18 distinct parts, with part numbers taken from the project's own BOM. The full bill of materials is listed on this page.

Where can I download the Merged17 design files?

From the pentolope/PCB_MicrophoneArrayV2 repository on GitHub, which has the KiCad layout and the BOM; the links under Design files point to each one.

Can I use the Merged17 design in my own project?

The repository has no license, so all rights stay with pentolope. Use it as a reference, and ask the author before reusing the design.

More boards in PCB_MicrophoneArrayV2