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Solder Reflow Oven 2.0

1sand0s·Solder_Reflow_Oven_2.0·Hardware/Solder_Reflow_Oven_2.0.kicad_pcb

Solder Reflow Oven 2.0 PCB layout, top view — open source STM32 board by 1sand0s

About the Solder Reflow Oven 2.0 PCB

Solder Reflow Oven 2.0 is an open source STM32 PCB design by 1sand0s, published on GitHub under the MIT license. It is a 2-layer board measuring 64.8 × 61.2 mm, with 46 components from 30 distinct parts.

Its main chip is the STM32L053R6T6, from the STM32 family. Other key parts include the LM2940IMPX-10/NOPB, MAX31855KASA, RCLAMP0502A.TCT, CDBHD140L-G and F24-100-C2. By type, the board carries 16 capacitors, 8 ICs, 8 connectors, 8 resistors, 2 diodes and 1 transistor.

It belongs with the displays & leds designs in this gallery.

From the project

Solder Reflow Oven 2.0 - A homebrew solder reflow oven controller designed around an STM32L053 series MCU - PCB layouting done in Kicad

1. The pads of the PCB are covered in solder paste, typically done with the help of a stencil

2. The components are then carefully placed on the board, the paste helps in providing adhesion to hold the components in place

3. The board is then placed inside the oven which controls the ambient temperature to follow a certain profile (specific to the solder paste used)

Solder Reflow Oven 2.0, from the project README
From the project README

Main components on the Solder Reflow Oven 2.0

LM2940IMPX-10/NOPBMAX31855KASARCLAMP0502A.TCTSTM32L053R6T6CDBHD140L-GF24-100-C2SPDT_ReflowLD1117S33TR_SOT223

Solder Reflow Oven 2.0 bill of materials (BOM)

46 components, 30 distinct parts.

QtyPartRefs
1
LM2940IMPX-10/NOPB
U1
1
MAX31855KASA
U2
1
RCLAMP0502A.TCT
U3
1
STM32L053R6T6
U4
1
CDBHD140L-G
U5
1
F24-100-C2
U6
1
SPDT_Reflow
U7
1
LD1117S33TR_SOT223
U8
1
2SD1805
Q1
1
Crystal_GND24
Y1
3
Conn_01x02_Male
J1, J3, J6
1
USB_B
J2
1
Conn_02x03_Top_Bottom
J4
2
Conn_01x02_Top_Bottom
J5, J8
1
Conn_01x24_Male
J7
1
SW_DIP_x01
SW1
2
LED
D1, D2
1
MMZ1005S601HTD25
FB1
2
8pF
C1, C7
2
0.1uF
C2, C16
Show 10 more
QtyPartRefs
4
10uF
C3, C4, C5, C6
5
100nF
C8, C9, C11, C12, C15
1
470uF
C10
1
22uF
C13
1
1uF
C14
1
260
R1
1
653
R2
3
10k
R3, R6, R8
1
10
R4
2
1k
R7, R9

Solder Reflow Oven 2.0 design files

The KiCad project lives in the 1sand0s/Solder_Reflow_Oven_2.0 repository on GitHub; these links point at the commit this page was built from.

Solder Reflow Oven 2.0: common questions

What microcontroller does the Solder Reflow Oven 2.0 use?

The Solder Reflow Oven 2.0 is built around the STM32L053R6T6, from the STM32 family.

How big is the Solder Reflow Oven 2.0 PCB?

The Solder Reflow Oven 2.0 measures 64.8 × 61.2 mm, has 2 copper layers and is 1.6 mm thick.

How many components are on the Solder Reflow Oven 2.0?

46 components, from 30 distinct parts. The full bill of materials is listed on this page.

Where can I download the Solder Reflow Oven 2.0 design files?

From the 1sand0s/Solder_Reflow_Oven_2.0 repository on GitHub, which has the KiCad layout; the links under Design files point to each one.

Can I use the Solder Reflow Oven 2.0 design in my own project?

Yes, under the terms of its MIT license, which 1sand0s chose for the repository.

Can I test firmware for the Solder Reflow Oven 2.0 without the hardware?

Yes. HardLabs builds a simulation of the board from its netlist and BOM, so you can run and debug STM32 firmware against it before you order a PCB.

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