HardLabs

Core-XIAO-03

sastles-com·FPC-isolation-sphere·kiban/core-XIAO-03/core-XIAO-03.kicad_pcb

Core-XIAO-03 PCB layout, top view — open source RP2040/RP2350 board by sastles-com

About the Core-XIAO-03 PCB

Core-XIAO-03 is an open source RP2040/RP2350 PCB design by sastles-com, published on GitHub. It is a 2-layer board measuring 49 × 40 mm, with 26 components from 19 distinct parts.

Its main chip is the MOUDLE-SEEEDUINO-XIAO-ESP32S3, from the RP2040/RP2350 family. By type, the board carries 11 connectors, 8 capacitors, 3 resistors, 1 IC, 1 speaker and 1 diode.

It belongs with the displays & leds designs in this gallery.

From the project

直径 100 mm の球体 LED ディスプレイ。約 800 個の WS2812-2020 を ゴールドバーグ多面体 T=81 の球面に配置した "デジタル地球儀" 風ピクセルディスプレイ。

直径 100 mm の球体 LED ディスプレイ。約 800 個の WS2812-2020 を ゴールドバーグ多面体 T=81 の球面に配置した "デジタル地球儀" 風ピクセルディスプレイ。

A 100 mm spherical LED display with ~800 WS2812-2020 pixels arranged on a Goldberg polyhedron (T=81) shell.

前作はスパイラル配線＋接着剤固定で LED 1 個の故障が全損につながる設計だった。 V2 では カセット交換式・接着剤ゼロ に全面刷新する。

- [x] Goldberg T=81 メッシュ生成（goldberg.py） - [x] カセット分割・可視化（Blender Python） - [x] ヘキサゴン錐 + 円柱アパーチャの Boolean 生成（aperturebooleandemo.py） - [ ] カセット外殻 STL 完成 - [ ] FPC（骨組み基板）KiCad 設計 - [ ] 極専用 Rigid PCB × 2 - [ ] 赤道マザーリング基板 - [ ] ファームウェア（ESP32）

Main components on the Core-XIAO-03

MOUDLE-SEEEDUINO-XIAO-ESP32S3

Core-XIAO-03 bill of materials (BOM)

26 components, 19 distinct parts — part numbers from the project's BOM.

QtyPartRefs
1
MOUDLE-SEEEDUINO-XIAO-ESP32S3
U2
1
POWER
J1
1
ESP32-01
J2
1
SPI
J3
1
ESP32-02
J4
1
3V3
J5
1
5V
J6
1
I2C
J9
1
TP_VIN
J12
1
TP_3V3
J13
1
TP_PGND
J14
1
VIN
J15
1
SPEAKER
LS1
1
LED
D1
1
FerriteBead_Small
FB1
3
10UF
10uF
C1, C5, C8
5
0.1UF
0.1uF
C2, C3, C6, C7, C9
1
330Ω
R1
2
10kΩ
R2, R3

Core-XIAO-03 design files

The KiCad project lives in the sastles-com/FPC-isolation-sphere repository on GitHub; these links point at the commit this page was built from.

Core-XIAO-03: common questions

What microcontroller does the Core-XIAO-03 use?

The Core-XIAO-03 is built around the MOUDLE-SEEEDUINO-XIAO-ESP32S3, from the RP2040/RP2350 family.

How big is the Core-XIAO-03 PCB?

The Core-XIAO-03 measures 49 × 40 mm, has 2 copper layers and is 1.6 mm thick.

How many components are on the Core-XIAO-03?

26 components, from 19 distinct parts, with part numbers taken from the project's own BOM. The full bill of materials is listed on this page.

Where can I download the Core-XIAO-03 design files?

From the sastles-com/FPC-isolation-sphere repository on GitHub, which has the KiCad layout, the schematic and the BOM; the links under Design files point to each one.

Can I use the Core-XIAO-03 design in my own project?

The repository has no license, so all rights stay with sastles-com. Use it as a reference, and ask the author before reusing the design.

Can I test firmware for the Core-XIAO-03 without the hardware?

Yes. HardLabs builds a simulation of the board from its netlist and BOM, so you can run and debug RP2040/RP2350 firmware against it before you order a PCB.

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