Leos-F26-power
clee303·leos-F26-power-pcb
About the Leos-F26-power PCB
Leos-F26-power is an open source RP2040/RP2350 PCB design by clee303, published on GitHub. It is a 2-layer board measuring 100 × 100 mm, with 13 components from 8 distinct parts.
Its main chip is the PIM724, from the RP2040/RP2350 family. Other key parts include the MCP2518FDT-E/SL and MCP2562FDT-H/SN. By type, the board carries 7 capacitors, 2 ICs, 2 connectors, 1 module and 1 crystal.
From the project
power board made fall 2026
This repository is the starting-point PCB template for VIP Lightning From the Edge of Space (LEOS). All LEOS modules should be spun off from this template so that every module begins with the standard Raspberry Pi Pico, CAN-FD network, stack connectors, board shape, and mechanical layout.
Do not fork or clone this repository as the permanent home of a new module. Create a fresh repository from the public GitHub template instead:

Main components on the Leos-F26-power
Leos-F26-power bill of materials (BOM)
13 components, 8 distinct parts.
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 1 | MCP2518FDT-E/SL MCP2518FD Microchip | SOIC-14_3.9x8.7mm_P1.27mm | U1 |
| 1 | MCP2562FDT-H/SN MCP2562FD Microchip | SOIC-8_3.9x4.9mm_P1.27mm | U2 |
| 1 | PIM724 RaspberryPi Pico Pimoroni | RaspberryPi_Pico_Common_Unspecified | A1 |
| 1 | ECS-400-10-37B2-CKY-TR 40 MHz ECS Inc, | Crystal_SMD_2016-4Pin_2.0x1.6mm | Y1 |
| 2 | 0436500409 MicroFit_1x4 Molex | Molex_MicroFit3.0_43650-0410_1x04_Horizontal | J1, J2 |
| 3 | CL21B104KBCNNNC 0.1u Samsung Electro-Mechanics | C_0805_2012Metric | C1, C2, C3 |
| 2 | CL21C100CBANNNC 10p Samsung Electro-Mechanics | C_0805_2012Metric | C4, C5 |
| 2 | CL31B226MPHNNNE 22u Samsung Electro-Mechanics | C_1206_3216Metric | C6, C7 |
Leos-F26-power design files
The KiCad project lives in the clee303/leos-F26-power-pcb repository on GitHub; these links point at the commit this page was built from.
- LayoutLEOS-stack-template.kicad_pcb
- SchematicLEOS-stack-template.kicad_sch
Leos-F26-power: common questions
What microcontroller does the Leos-F26-power use?
The Leos-F26-power is built around the PIM724, from the RP2040/RP2350 family.
How big is the Leos-F26-power PCB?
The Leos-F26-power measures 100 × 100 mm, has 2 copper layers and is 1.6 mm thick.
How many components are on the Leos-F26-power?
13 components, from 8 distinct parts. The full bill of materials is listed on this page.
Where can I download the Leos-F26-power design files?
From the clee303/leos-F26-power-pcb repository on GitHub, which has the KiCad layout and the schematic; the links under Design files point to each one.
Can I use the Leos-F26-power design in my own project?
The repository has no license, so all rights stay with clee303. Use it as a reference, and ask the author before reusing the design.
Can I test firmware for the Leos-F26-power without the hardware?
Yes. HardLabs builds a simulation of the board from its netlist and BOM, so you can run and debug RP2040/RP2350 firmware against it before you order a PCB.
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