Flip phone
About the Flip phone PCB
Flip phone is an open source STM32 PCB design by denglermoss, published on GitHub. It is a 2-layer board measuring 50 × 80 mm, with 130 components from 51 distinct parts.
Its main chip is the STM32H743ZIT6, from the STM32 family. Other key parts include the PCIE-52P40H_C444926, TXB0108PWR, ALC5651-CG, ESDA6V1-5SC6 and TPS63021DSJR. By type, the board carries 48 capacitors, 32 resistors, 21 switches, 11 ICs, 2 connectors and 2 LEDs.
From the project
Custom flip phone design and build — hardware, firmware, and mechanical
Designing and building a custom cell phone from scratch — hardware (PCB, electronics), embedded firmware, cellular communication, and eventually mechanical/enclosure design. Candybar / single-board form factor (locked 2026-08-16 — flip/clamshell deferred to v2). Long-term vision: the phone is the hub of a personal ecosystem of USB-connected devices. See docs/ref/problem-definition.md for full architecture, MVP, risks, and ecosystem vision.
Main components on the Flip phone
Flip phone bill of materials (BOM)
130 components, 51 distinct parts.
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 1 | STM32H743ZIT6 | LQFP-144_L20.0-W20.0-P0.50-LS22.0-BL | U1 |
| 1 | PCIE-52P40H_C444926 | PCIE-SMD_PCIE-52P40H-1 | U2 |
| 1 | TXB0108PWR | TSSOP-20_L6.5-W4.4-P0.65-LS6.4-BL | U3 |
| 1 | ALC5651-CG | QFN-40_L5.0-W5.0-P0.40-BL-EP3.7 | U5 |
| 2 | ESDA6V1-5SC6 | SOT-23-6_L2.9-W1.6-P0.95-LS2.8-BR | U6, U7 |
| 1 | TPS63021DSJR TI(德州仪器) | VSON-14_L4.0-W3.0-P0.50-BL-EP_TI_DSJ | U8 |
| 1 | TPS7A0218PDBVR TI(德州仪器) | SOT-23-5_L2.9-W1.6-P0.95-LS2.8-BL | U9 |
| 1 | MAX17048G+T10 ADI(亚德诺)/MAXIM(美信) | TDFN-8_L2.0-W2.0-P0.50-BL-EP1.2 | U10 |
| 1 | MCP73831-2ACI/MC MICROCHIP(美国微芯) | TDFN-8_L3.0-W2.0-P0.50-BL-EP1.6 | U11 |
| 1 | SN74AXC4T774PWR TI | TSSOP-16_L5.0-W4.4-P0.65-LS6.4-TL | U12 |
| 1 | ECS-80-12-33Q-GN-TR | CRYSTAL-SMD_4P-L3.2-W2.5-BL | Y1 |
| 1 | S2B-PH-SM4-TB(LF)(SN) S2B-PH-SM4-TB JST | CONN-SMD_P2.00_S2B-PH-SM4-TB-LF-SN | CN1 |
| 1 | Conn_01x04 | PinHeader_1x04_P2.54mm_Vertical | J1 |
| 1 | 0.5K-HX-12PWB | FPC-SMD_12P-P0.50_HDGC_0.5K-HX-12PWB | J_DISP1 |
| 1 | 0.5K-HX-8PWB | FPC-SMD_8P-P0.50_HDGC_0.5K-HX-8PWB | J_DISP2 |
| 3 | S2B-PH-SM4-TB | CONN-SMD_P2.00_S2B-PH-SM4-TB-LF-SN | J_EARPIECE1, J_MIC1, J_SPK1 |
| 2 | 0.5K-HX-14PWB | FPC-SMD_14P-P0.50_HDGC_0.5K-HX-14PWB | J_HINGE1, J_HINGE2 |
| 1 | 472192001 | TF-SMD_472192001 | J_SD1 |
| 1 | NANOSIMXG6PH1.35 | SIM-SMD_NANO-SIM-XG6P-H1.35 | J_SIM1 |
| 20 | SKQGABE010 ALPSALPINE | KEY-SMD_4P-L5.2-W5.2-P3.70-LS6.4 | SW1, SW2, SW3, SW4, SW5, SW6, SW7, SW8 +12 |
Show 31 more
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 1 | SSSS811101 ALPSALPINE | SW-SMD_SSSS811101 | SW21 |
| 1 | TYPE-C-31-M-12 韩国韩荣 | USB-C_SMD-TYPE-C-31-M-12_1 | USBC1 |
| 2 | LTST-C191TBKT LITEON(光宝) | LED0603-RD | LED1, LED2 |
| 1 | USBLC6-2SC6 ST(意法半导体) | SOT-23-6_L2.9-W1.6-P0.95-LS2.8-BL | D1 |
| 1 | XFL4020-152MEC Coilcraft(线艺) | IND-SMD_L4.0-W4.0-A | L1 |
| 1 | BLM18KG601SN1D muRata(村田) | L0603 | L2 |
| 19 | 100nF | C0603 | C1, C2, C3, C5, C6, C7, C9, C10 +11 |
| 2 | 2.2uF | C0603 | C4, C13 |
| 2 | 22pF | C0603 | C8, C11 |
| 5 | 10uF | C0805 | C18, C19, C21, C22, C23 |
| 1 | 470uF | CAP-SMD_L7.3-W4.3 | C20 |
| 2 | GRM21BR61H106KE43L muRata(村田) | C0805 | C30, C31 |
| 3 | GRM21BR61A226ME51L muRata(村田) | C0805 | C32, C33, C34 |
| 2 | GRM188R61C105KA93D muRata(村田) | C0603 | C35, C36 |
| 4 | CC0603KRX7R9BB104 YAGEO(国巨) | C0603 | C37, C38, C46, C47 |
| 3 | GRM188R61C475KE11D muRata(村田) | C0603 | C39, C40, C45 |
| 4 | CC0603KRX5R8BB225 YAGEO(国巨) | C0603 | C41, C42, C43, C44 |
| 1 | GRM188R61C105KA93D 1uF muRata(村田) | C0603 | C48 |
| 3 | 10k | C0603 | R1, R2, R3 |
| 1 | 100k | R0603 | R4 |
| 1 | 1k | R0603 | R6 |
| 15 | 10k | R0603 | R7, R8, R9, R12, R13, R14, R15, R16 +7 |
| 2 | 4.7k | R0603 | R10, R11 |
| 1 | 4R7 | R0603 | R19 |
| 1 | 0603WAF1000T5E 10k UNI-ROYAL(厚声) | R0603 | R20 |
| 1 | RC0603JR-071ML YAGEO(国巨) | R0603 | R21 |
| 2 | RC0603JR-0710KL YAGEO(国巨) | R0603 | R22, R23 |
| 2 | RC0603FR-075K1L YAGEO(国巨) | R0603 | R24, R25 |
| 1 | RC0603JR-07470RL YAGEO(国巨) | R0603 | R26 |
| 1 | RC0603FR-072KL YAGEO(国巨) | R0603 | R27 |
| 1 | RC0603FR-0768KL YAGEO(国巨) | R0603 | R28 |
Flip phone design files
The KiCad project lives in the denglermoss/flip-phone repository on GitHub; these links point at the commit this page was built from.
- Layoutpcb/phone/phone.kicad_pcb
- Schematicpcb/phone/phone.kicad_sch
Flip phone: common questions
What microcontroller does the Flip phone use?
The Flip phone is built around the STM32H743ZIT6, from the STM32 family.
How big is the Flip phone PCB?
The Flip phone measures 50 × 80 mm, has 2 copper layers and is 1.6 mm thick.
How many components are on the Flip phone?
130 components, from 51 distinct parts. The full bill of materials is listed on this page.
Where can I download the Flip phone design files?
From the denglermoss/flip-phone repository on GitHub, which has the KiCad layout and the schematic; the links under Design files point to each one.
Can I use the Flip phone design in my own project?
The repository has no license, so all rights stay with denglermoss. Use it as a reference, and ask the author before reusing the design.
Can I test firmware for the Flip phone without the hardware?
Yes. HardLabs builds a simulation of the board from its netlist and BOM, so you can run and debug STM32 firmware against it before you order a PCB.
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