BB3plus test mainboard
About the BB3plus test mainboard PCB
BB3plus test mainboard is an open source STM32 PCB design by eez-open, published on GitHub under the TAPR-OHL-1.0 license. It is a 4-layer board measuring 180.5 × 176 mm, with 262 components from 87 distinct parts.
Its main chip is the STM32G071R8T6, from the STM32 family. Other key parts include the SN74HCS02PWR, TPS3851H18EDRBR, M24C32-DFDW6TP, TPA6205A1DGN and SN74LVC1G14DBVR. By type, the board carries 103 capacitors, 74 resistors, 18 ICs, 15 crystals, 10 diodes and 10 inductors.
It belongs with the power & battery designs in this gallery.
From the project
EEZ Bench Box 3 Plus (BB3+) Modular T&M chassis
EEZ BB3+ was conceived as a successor to the BB3 project, which would bring a number of modifications and improvements. The following modifications are planned:
[x] Combining 3 existing core modules (power supply, MCU and backplane) into a single mainboard [x] Enlarge TFT touchscreen from 4.3" (480x272) resistive to 5" (800x480) capacitive [x] Increase fan size from Ø80 to 92 mm [x] Single main power rail +12V (45/60 W) [x] Introducing half width modules and increasing the total number of modules from 3 full-width to 5 half-width (or two 1½-width) [x] TFT Display PCB with 4 user switch/hot…
Main components on the BB3plus test mainboard
BB3plus test mainboard bill of materials (BOM)
262 components, 87 distinct parts.
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 1 | SN74HCS02PWR | TSSOP-14 | IC1 |
| 1 | TPS3851H18EDRBR | DRV8601DRBT | IC2 |
| 1 | M24C32-DFDW6TP | TSSOP-8 | IC3 |
| 1 | STM32G071R8T6 | LQFP-64_10x10MM | IC4 |
| 1 | TPA6205A1DGN | DGN8_1P89X1P57-L | IC5 |
| 1 | SN74LVC1G14DBVR | DBV5 | IC6 |
| 1 | LM64460CPPQRYFRQ1 | VQFN22_RYF_TEX | IC7 |
| 2 | TPS62933ODRLR | DRL0008A | IC8, IC10 |
| 1 | USB5816C-I/KD | VQFN100_KDX_MCH-L | IC9 |
| 1 | FUSB303BTMX | RWB0012A | IC11 |
| 1 | TPS2068E | DBV5 | IC12 |
| 1 | RT9742SNGV | SOT23-3 | IC13 |
| 3 | TPD4E001DRLR | DRL6 | IC14, IC15, IC18 |
| 1 | TPD12S016PWR | PW24 | IC16 |
| 1 | MIC2026A-1YM-TR | SOIC127P600X173-8N | IC17 |
| 3 | DMP3013SFV-7 | TRANS_FDMC8010 | Q1, Q7, Q8 |
| 3 | 2N7002 | SOT103P240X110-3N | Q2, Q3, Q6 |
| 2 | MMBT5401 | SOT23-BEC | Q4, Q5 |
| 1 | 1-2199230-6 | 1-2199230-6 with holes (80 mm) | X1 |
| 1 | 571-0400 | 571-0X00 Deltron | X3 |
Show 67 more
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 1 | GSP1.9101.1 | GSP191011 | X4 |
| 1 | PJ-002BH-SMT-TR | CUI_PJ-002BH-SMT-TR | X5 |
| 1 | USB4056-03-A | USB4056-03-A_REVA2 | X6 |
| 1 | 0862-1J1T-43-F | 0862-1J1T-43-F | X7 |
| 1 | SS-53000-002 | 2086588121 | X8 |
| 1 | 5051102091 | 5051102291 | X9 |
| 2 | 1001878410201TLF | 10018783-10101TLF | X10, X13 |
| 2 | 77313-802-20LF | 77313-802-20LF | X11, X12 |
| 1 | TBP03R1-350-10BE | TBP03R1-350-10BE | X15 |
| 1 | 32.768KHz | ABS07AIG | Y1 |
| 1 | VXM7-9032-25M0000000 | XTAL_403C11A24M00000 | Y2 |
| 3 | ~ | M22-2010346 | JP1, JP11, JP13 |
| 3 | 0R | JP3 shorted with 0R (0603) 2-3 | JP2, JP6, JP14 |
| 3 | ~ | M22-2010246 | JP3, JP4, JP5 |
| 1 | 2x 10164227-1004A1RLF | Raspberry-Pi-CM5 (MB) | Module1 |
| 1 | TLP291(GB.SE(T | SOIC127P700X210-4N | OK1 |
| 1 | CMI-9605-1280T | CMI-9605-1280T | SP1 |
| 1 | CMS-151504-SMT-TR | CMS-151504-SMT-TR | SP2 |
| 1 | WBL2UOAGQR05CLR | WBL2UOAGQR05CLR | SW1 |
| 1 | PEC16-2215F-S0024 | PEC16-2215F | SW2 |
| 1 | IRM-45-12 | IRM-45 | TR1 |
| 1 | BZT52-B3V9X | SOD123 | ZD1 |
| 2 | LTST-C170KGKT | LED_LTST-C170KGKT_LTO-L | LED1, LED5 |
| 5 | LTST-C170KRKT | LED_LTST-C170KGKT_LTO-L | LED2, LED3, LED4, LED6, LED7 |
| 8 | BAS316 | SOD-323_1P8X1P35_ONS-M | D1, D2, D3, D4, D5, D6, D7, D8 |
| 1 | BAT54C | SOT23-3 | D9 |
| 1 | PTVS22VP1UP.115 | SOD-123FL | D10 |
| 3 | 60R@100MHz | BEAD0603 | FB1, FB5, FB6 |
| 3 | BLE18PS080SN1D | BEAD0603 | FB2, FB3, FB4 |
| 1 | 6u8 | IND_0606306R8MA1_YAG | L1 |
| 2 | 1u | INDPM7166X300N | L2, L4 |
| 1 | 2u2 | INDPM7166X300N | L3 |
| 50 | 100n | C_0603_1608Metric | C1, C2, C3, C5, C6, C7, C13, C14 +42 |
| 8 | 10u | C_0805_2012Metric | C4, C22, C29, C31, C38, C51, C69, C97 |
| 2 | 6p8 | C_0603_1608Metric | C8, C9 |
| 8 | 10n | C_0603_1608Metric | C10, C26, C27, C33, C35, C39, C49, C50 |
| 3 | 4u7 | C_0603_1608Metric | C11, C12, C80 |
| 4 | 1u | C_0603_1608Metric | C15, C24, C32, C41 |
| 1 | 2n2 | C_0603_1608Metric | C16 |
| 4 | 220n | C_0603_1608Metric | C17, C18, C19, C21 |
| 1 | CE5R5105HF-ZJ | CE5R5105HF-ZJ | C20 |
| 1 | 100n/X2 | C150-054X183 | C23 |
| 1 | EEEFK1V470P | CAPAE660X610N | C25 |
| 10 | 22u | C_0805_2012Metric | C40, C43, C44, C45, C46, C47, C48, C65 +2 |
| 2 | 47p | C_0603_1608Metric | C42, C58 |
| 2 | 10p | C_0603_1608Metric | C55, C56 |
| 3 | 865080142007 | CAP-ASLI_5X5.5_DXL_ | C68, C101, C102 |
| 3 | 10n/200V | C_1206_3216Metric | C87, C99, C103 |
| 23 | 10K | R_0603_1608Metric | R1, R4, R10, R13, R22, R29, R36, R37 +15 |
| 6 | 330R | R_0603_1608Metric | R2, R3, R5, R9, R75, R76 |
| 6 | 100K | R_0603_1608Metric | R6, R7, R38, R39, R60, R63 |
| 3 | 100R | R_0603_1608Metric | R11, R14, R27 |
| 4 | 47K | R_0603_1608Metric | R12, R30, R31, R67 |
| 4 | 1K8 | R_0603_1608Metric | R15, R16, R24, R41 |
| 7 | 20K | R_0603_1608Metric | R17, R18, R21, R23, R25, R26, R65 |
| 1 | 18K | R_0603_1608Metric | R19 |
| 2 | 12K | R_0603_1608Metric | R20, R62 |
| 2 | 1K | R_0603_1608Metric | R28, R33 |
| 1 | 470K | R_0805_2012Metric | R32 |
| 1 | 3K3 | R_0603_1608Metric | R34 |
| 4 | 200K | R_0603_1608Metric | R35, R49, R54, R58 |
| 1 | 36K5 | R_0603_1608Metric | R42 |
| 1 | 11K8 | R_0603_1608Metric | R43 |
| 1 | 43K | R_0603_1608Metric | R50 |
| 1 | 49K9 | R_0603_1608Metric | R51 |
| 4 | 499K | R_0603_1608Metric | R68, R69, R72, R73 |
| 2 | 68R | R_0603_1608Metric | R70, R71 |
BB3plus test mainboard design files
The KiCad project lives in the eez-open/eez-bb3plus repository on GitHub; these links point at the commit this page was built from.
BB3plus test mainboard: common questions
What microcontroller does the BB3plus test mainboard use?
The BB3plus test mainboard is built around the STM32G071R8T6, from the STM32 family.
How big is the BB3plus test mainboard PCB?
The BB3plus test mainboard measures 180.5 × 176 mm, has 4 copper layers and is 1.605 mm thick.
How many components are on the BB3plus test mainboard?
262 components, from 87 distinct parts. The full bill of materials is listed on this page.
Where can I download the BB3plus test mainboard design files?
From the eez-open/eez-bb3plus repository on GitHub, which has the KiCad layout and the schematic; the links under Design files point to each one.
Can I use the BB3plus test mainboard design in my own project?
Yes, under the terms of its TAPR-OHL-1.0 license, which eez-open chose for the repository.
Can I test firmware for the BB3plus test mainboard without the hardware?
Yes. HardLabs builds a simulation of the board from its netlist and BOM, so you can run and debug STM32 firmware against it before you order a PCB.
More boards in eez-bb3plus
STM32BB3plus mainboard
233 × 230.5 mm353 parts4LTAPR-OHL-1.012
STM32BB3plus USB hub test
144.5 × 103 mm223 parts4LTAPR-OHL-1.012
BB3plus DVID TFT display
136 × 92 mm50 parts2LTAPR-OHL-1.012
BB3plus DSI TFT display
136 × 92 mm28 parts2LTAPR-OHL-1.012
DIB2 USB adapter
91.4 × 92.5 mm11 parts4LTAPR-OHL-1.012
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