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Xinghongpai nearlink dev board

HuaqiuOpenHardware·xinghongpai-nearlink-dev-board·hardware/kicad/HXTX_XS_WEAR_底板_4.0_v125_2026-01-09-12-46.kicad_pcb

Xinghongpai nearlink dev board layout, top view — open source board by HuaqiuOpenHardware
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About the Xinghongpai nearlink dev board

Xinghongpai nearlink dev board is an open source PCB design by HuaqiuOpenHardware, published on GitHub under the Custom license license. It is a 2-layer board measuring 96 × 70 mm, with 49 components from 23 distinct parts.

Other key parts include the AHT20, CH340N and AMS1117-3.3. By type, the board carries 19 resistors, 13 capacitors, 5 connectors, 4 ICs, 2 diodes and 1 LED.

It belongs with the dev boards & breakouts and iot & wireless designs in this gallery.

From the project

Xinghongpai WS63V100/Hi3863 NearLink (SLE) open-source development board with KiCad schematic/PCB, BOM and OpenHarmony examples. 星鸿派星闪开发板。

This directory contains the KiCad hardware source files and BOM for the Xinghongpai NearLink development board.

本目录保存星鸿派 WS63V100 / Hi3863 星闪开发板的 KiCad 原理图、PCB 与 BOM。制造或修改前请同时核对原理图、PCB、BOM 和实际板卡版本。

- kicad/.kicadpro: KiCad project. - kicad/.kicadsch: Schematic source. - kicad/.kicadpcb: PCB layout source. - bom/BOMBoard1Schematic12026-01-09.xlsx`: Bill of materials.

Main components on the Xinghongpai nearlink dev board

AHT20CH340NAMS1117-3.3

Xinghongpai nearlink dev board bill of materials (BOM)

49 components, 23 distinct parts — part numbers from the project's BOM.

QtyPartRefs
1
AHT20
广州奥松
U1
1
CH340N
WCH(南京沁恒)
U2
1
AMS1117-3.3
AMS
U3
1
—
U6
1
WAFER-XH254WZ-2AM
HANBO(汉博)
CN6
2
KH-2.54FH-1X12P-H8.5
kinghelm(金航标)
J9, J10
2
X6511WV-12H-C60D30
XKB Connection(中国星坤)
J11, J12
4
—
H1, H2, H3, H4
1
—
hanxia(韩下)
Z1
1
HS96L03W2C03
HS(汉昇)
OLED1
1
NCD0805R1
国星光电
D1
1
SMF12CA
Littelfuse(美国力特)
D2
7
CL10B104KB8NNNC
100nF
SAMSUNG(三星)
C1, C4, C5, C8, C11, C14, C20
4
CL21A226MAQNNNE
22uF
SAMSUNG(三星)
C2, C3, C7, C10
2
CL10A475KO8NNNC
4.7uF
SAMSUNG(三星)
C6, C21
2
0603WAF0000T5E
0Ω
UNI-ROYAL(厚声)
R1, R2
2
0603WAF5101T5E
5.1kΩ
UNI-ROYAL(厚声)
R3, R4
1
0603WAF4700T5E
470Ω
UNI-ROYAL(厚声)
R5
2
0603WAF1002T5E
10kΩ
UNI-ROYAL(厚声)
R6, R7
1
0603WAF1001T5E
1kΩ
UNI-ROYAL(厚声)
R11
Show 3 more
QtyPartRefs
2
0603WAF1003T5E
100kΩ
UNI-ROYAL(厚声)
R12, R22
7
0603WAF3000T5E
300Ω
UNI-ROYAL(厚声)
R13, R14, R15, R16, R18, R21, R23
2
0603WAF4701T5E
4.7kΩ
UNI-ROYAL(厚声)
R19, R20

Xinghongpai nearlink dev board design files

The KiCad project lives in the HuaqiuOpenHardware/xinghongpai-nearlink-dev-board repository on GitHub; these links point at the commit this page was built from.

Xinghongpai nearlink dev board: common questions

How big is the Xinghongpai nearlink dev board?

The Xinghongpai nearlink dev board measures 96 × 70 mm, has 2 copper layers and is 1.6 mm thick.

How many components are on the Xinghongpai nearlink dev board?

49 components, from 23 distinct parts, with part numbers taken from the project's own BOM. The full bill of materials is listed on this page.

Where can I download the Xinghongpai nearlink dev board design files?

From the HuaqiuOpenHardware/xinghongpai-nearlink-dev-board repository on GitHub, which has the KiCad layout, the schematic and the BOM; the links under Design files point to each one.

Can I use the Xinghongpai nearlink dev board design in my own project?

It is published under Custom license, which limits how it may be reused; read the license before building on it.

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