Microduck TDK Power R8
ldcyes·OpenDuck·hardware/kicad/TDK_Power_R8/Microduck_TDK_Power_R8.kicad_pcb
About the Microduck TDK Power R8 PCB
Microduck TDK Power R8 is an open source PCB design by ldcyes, published on GitHub. It is a 2-layer board measuring 65 × 60 mm, with 43 components from 24 distinct parts.
Other key parts include the i7C2W020A120V-P03-R, LM74800QDRRRQ1, INA226AIDGSR and INA300AIDGSR. By type, the board carries 19 capacitors, 11 resistors, 4 ICs, 3 transistors and 1 connector.
From the project
本仓库整理 Microduck 的结构、电气、步态数值验证,以及 RK3576 驱动和训练适配源。当前是工程仿真预发布,尚未通过实物制造与正常步速行走验收。
本仓库整理 Microduck 的结构、电气、步态数值验证,以及 RK3576 驱动和训练适配源。当前是工程仿真预发布,尚未通过实物制造与正常步速行走验收。
R29 将嘴部软件行程收至 0–10° 并修正下头壳;指定腿罩/电机配对在四条新质量慢速轨迹中的最低保守名义间隙下界为 11.407 mm。31 根线的防磨件和四工况动力学已补充,但嘴部闭合扭矩仍超过现行 0.05 Nm 结构限制,连续线束及制造公差尚无实物证明,不能放行行走。
沿用R25:31根头部导线改为底部接入,保留前盖与原外形比例;收拢活动线束并取消原侧面专用线孔。底部走线特写。仍为工程候选,离散转头检查不代表连续运动或实物验收。
历史四步回放:R27:R26整机运动回放。 使用已保存的195.44秒实际积分轨迹,逐帧驱动完整R26装配并复核覆盖件的刚体干涉增量;R26质量下的动力学和实物行走仍待验收。

Main components on the Microduck TDK Power R8
Microduck TDK Power R8 bill of materials (BOM)
43 components, 24 distinct parts — part numbers from the project's BOM.
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 1 | i7C2W020A120V-P03-R TDK i7C2W020A120V-P03-R | TDK_i7C_P03 | U1 |
| 1 | LM74800QDRRRQ1 IDEAL DIODE + OV CUT | WSON-12-1EP_3x3mm_P0.5mm_EP1.5x2.5mm | U2 |
| 1 | INA226AIDGSR SERVO CURRENT / VBUS 0x41 | MSOP-10_3x3mm_P0.5mm | U3 |
| 1 | INA300AIDGSR HARDWARE OC LATCH | MSOP-10_3x3mm_P0.5mm | U4 |
| 2 | CSD18540Q5B 60V 2.2mOhm @10V | CSD18540Q5B_DNK | Q1, Q2 |
| 1 | BSS138 TDK enable sink | SOT-23 | Q3 |
| 1 | SM08B-SRSS-TB(LF)(SN) CONTROL 3.3V / RUN DEFAULT OFF | JST_SH_SM08B-SRSS-TB_1x08-1MP_P1.00mm_Horizontal | J1 |
| 1 | WSL27262L000FEA 2mOhm 1% 3W KELVIN | WSL2726_Kelvin | RS1 |
| 1 | SOLDER AWG16 4S SWITCHED + | WirePad_2p4mm_6mm | W1 |
| 1 | SOLDER AWG16 GND INPUT | WirePad_2p4mm_6mm | W2 |
| 1 | SOLDER AWG16 SERVO 10.8V | WirePad_2p4mm_6mm | W3 |
| 1 | SOLDER AWG16 GND OUTPUT | WirePad_2p4mm_6mm | W4 |
| 3 | EEUFR1E681 680uF 25V 20% | CP_Radial_D10.0mm_P5.00mm | C1, C2, C3 |
| 10 | GRM188R71H104KA93D 100nF | C_0603_1608Metric | C4, C5, C6, C7, C8, C9, C10, C11 +2 |
| 6 | GRM32ER71H106KA12L 10uF 50V | C_1210_3225Metric | C13, C14, C16, C17, C18, C19 |
| 1 | RT0603BRD072K45L 2.45k 0.1% | R_0603_1608Metric | R1 |
| 1 | RT0603BRD0717K4L 17.4k 0.1% | R_0603_1608Metric | R2 |
| 1 | ERJ-3EKF1001V 1k | R_0603_1608Metric | R3 |
| 1 | RT0603BRD078K38L 8.38k 0.1% | R_0603_1608Metric | R4 |
| 1 | RT0603BRD071KL 1k 0.1% | R_0603_1608Metric | R5 |
Show 4 more
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 1 | ERJ-3EKF1201V 1.2k | R_0603_1608Metric | R6 |
| 2 | ERJ-3EKF1003V 100k | R_0603_1608Metric | R7, R8 |
| 1 | RT0603BRD071K1L 1.10k 0.1% | R_0603_1608Metric | R9 |
| 2 | RT0603BRD0710RL 10R 0.1% | R_0603_1608Metric | R10, R11 |
Microduck TDK Power R8 design files
The KiCad project lives in the ldcyes/OpenDuck repository on GitHub; these links point at the commit this page was built from.
Microduck TDK Power R8: common questions
How big is the Microduck TDK Power R8 PCB?
The Microduck TDK Power R8 measures 65 × 60 mm, has 2 copper layers and is 1.6 mm thick.
How many components are on the Microduck TDK Power R8?
43 components, from 24 distinct parts, with part numbers taken from the project's own BOM. The full bill of materials is listed on this page.
Where can I download the Microduck TDK Power R8 design files?
From the ldcyes/OpenDuck repository on GitHub, which has the KiCad layout, the schematic and the BOM; the links under Design files point to each one.
Can I use the Microduck TDK Power R8 design in my own project?
The repository has no license, so all rights stay with ldcyes. Use it as a reference, and ask the author before reusing the design.
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