H616 devboard
Kononenko-K·Allwinner_H616_Devboard·Hardware/H616_LPDDR4/H616_devboard.kicad_pcb
About the H616 devboard PCB
H616 devboard is an open source STM32 PCB design by Kononenko-K, published on GitHub under the CERN-OHL-P-2.0 license. It is a 4-layer board measuring 58 × 66 mm, with 161 components from 35 distinct parts.
Its main chip is the STM32F411CEU6, from the STM32 family. Other key parts include the H616, K4F6E3S4HM-MGCJ, AXP313A, CP2102-GMR and MKDV08GCL-STP. By type, the board carries 84 capacitors, 36 resistors, 15 ICs, 9 test points, 7 diodes and 4 connectors.
It belongs with the dev boards & breakouts designs in this gallery.
From the project
A minimalistic development board designed for the Cortex-A53 Allwinner H616 SoC using KiCad
The DDR3 variant features a compact design optimized for simplicity and ease of learning. Key components include:
- Memory: Up to 8 Gbit (1 GB) of BGA-96 16x DDR3 RAM - Power Management: X-Powers AXP305 PMIC - Connectivity: Micro SD slot, USB HS Host connector - Communication: Integrated CP2102 USB-UART converter
The LPDDR4 variant offers enhanced capabilities tailored for my specific application, while also remaining suitable for educational use:

Main components on the H616 devboard
H616 devboard bill of materials (BOM)
161 components, 35 distinct parts.
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 1 | H616 Allwinner Tech | H616_TFBGA284 | U1 |
| 1 | K4F6E3S4HM-MGCJ IS43LQ32256A-062BLI SAMSUNG | BGA-200_10.0x14.5mm_Layout12x22_P0.80x0.65mm | U2 |
| 1 | AXP313A ~ X-Powers Tech | QFN-20-1EP_3x3mm_P0.4mm_EP1.65x1.65mm_ThermalVias | U3 |
| 1 | CP2102-GMR CP2102N-Axx-xQFN28 SKYWORKS/SILICON LABS | QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm | U4 |
| 1 | STM32F411CEU6 STM32F411CEUx STMicroelectronics | QFN-48-1EP_7x7mm_P0.5mm_EP5.6x5.6mm | U5 |
| 1 | MKDV08GCL-STP MKDV1GCL-ABA MK | LGA-8_8x6mm_P1.27mm | U6 |
| 5 | SN74LVC1G157DB(LX) ~ lingxingic | SOT-23-6 | U7, U8, U9, U10, U11 |
| 1 | SN74LVC2G17DBVR(UMW) SN74LVC2G17DBVR UMW(Youtai Semiconductor Co., Ltd.) | SOT-23-6 | U12 |
| 1 | 74LVC1G08GV 74LVC1G08 TECH PUBLIC | SOT-23-5 | U13 |
| 1 | MT2492 XI'AN Aerosemi | SOT-23-6 | U14 |
| 1 | M24C02-WMN6TP M24C02-FMN STMicroelectronics | SOIC-8_3.9x4.9mm_P1.27mm | U17 |
| 2 | XTM25024000JT00351001 24MHz TOGNJING | Crystal_SMD_2520-4Pin_2.5x2.0mm | Y1, Y2 |
| 2 | XW10202-20R-00 Conn_01x20_MountingPin HCTL | TE_2-84952-0_1x20-1MP_P1.0mm_Horizontal | J2, J3 |
| 1 | Conn_01x04_Pin | PinHeader_1x04_P2.54mm_Vertical | J4 |
| 1 | HRS(Hirose) Micro_SD_Card_Det2 DM3AT-SF-PEJM5 | microSD_HC_Hirose_DM3AT-SF-PEJM5 | J5 |
| 9 | TestPoint | TestPoint_THTPad_D1.0mm_Drill0.5mm | TP2, TP3, TP4, TP5, TP7, TP8, TP9, TP10 +1 |
| 2 | LED | LED_0603_1608Metric_Pad1.05x0.95mm_HandSolder | D1, D2 |
| 5 | MBR0520 Jiangsu Changjing Electronics Technology Co., Ltd. | D_SOD-123 | D3, D4, D5, D6, D7 |
| 4 | FTC252012S2R2MBCA 1,5uH cjiang (Changjiang Microelectronics Tech) | L_Changjiang_FNR252010S | L1, L3, L4, L7 |
| 42 | CL05A225KO5NQNC 2.2u Samsung Electro-Mechanics | C_0402_1005Metric_Pad0.74x0.62mm_HandSolder | C4, C5, C6, C8, C9, C10, C11, C12 +34 |
Show 15 more
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 1 | 2.2p | C_0402_1005Metric_Pad0.74x0.62mm_HandSolder | C7 |
| 25 | GRM155R61A106ME44D 10u Murata Electronics | C_0402_1005Metric_Pad0.74x0.62mm_HandSolder | C15, C16, C18, C23, C26, C27, C28, C29 +17 |
| 8 | CL05B104KO5NNNC 100n Samsung Electro-Mechanics | C_0402_1005Metric_Pad0.74x0.62mm_HandSolder | C54, C55, C58, C61, C62, C63, C64, C80 |
| 5 | 0402CG180J500NT 18p FH (Guangdong Fenghua Advanced Tech) | C_0402_1005Metric_Pad0.74x0.62mm_HandSolder | C59, C60, C77, C78, C85 |
| 3 | CS3225X7R476K160NRL 47u Samwha Capacitor | C_1210_3225Metric_Pad1.33x2.70mm_HandSolder | C66, C67, C69 |
| 4 | RC0402FR-07100KL 100k YAGEO | R_0402_1005Metric_Pad0.72x0.64mm_HandSolder | R1, R2, R24, R27 |
| 3 | RC0402FR-07240RL 240R YAGEO | R_0402_1005Metric_Pad0.72x0.64mm_HandSolder | R3, R5, R6 |
| 1 | RC0402FR-07100RL 100R YAGEO | R_0402_1005Metric_Pad0.72x0.64mm_HandSolder | R4 |
| 6 | RC0402FR-072KL 2k YAGEO | R_0402_1005Metric_Pad0.72x0.64mm_HandSolder | R7, R14, R15, R16, R17, R18 |
| 5 | RC0402FR-0733RL 33R YAGEO | R_0402_1005Metric_Pad0.72x0.64mm_HandSolder | R10, R11, R21, R37, R38 |
| 9 | RC0402FR-0710KL 10k YAGEO | R_0402_1005Metric_Pad0.72x0.64mm_HandSolder | R12, R20, R22, R25, R26, R29, R30, R31 +1 |
| 2 | 10k | R_0402_1005Metric_Pad0.72x0.64mm_HandSolder | R13, R23 |
| 1 | RC0402FR-07150KL 150k YAGEO | R_0402_1005Metric_Pad0.72x0.64mm_HandSolder | R19 |
| 1 | RC0402FR-0722KL 22k YAGEO | R_0402_1005Metric_Pad0.72x0.64mm_HandSolder | R28 |
| 4 | RC0402FR-070RL 0R YAGEO | R_0402_1005Metric_Pad0.72x0.64mm_HandSolder | R33, R34, R35, R36 |
H616 devboard design files
The KiCad project lives in the Kononenko-K/Allwinner_H616_Devboard repository on GitHub; these links point at the commit this page was built from.
H616 devboard: common questions
What microcontroller does the H616 devboard use?
The H616 devboard is built around the STM32F411CEU6, from the STM32 family.
How big is the H616 devboard PCB?
The H616 devboard measures 58 × 66 mm, has 4 copper layers and is 1.552 mm thick.
How many components are on the H616 devboard?
161 components, from 35 distinct parts. The full bill of materials is listed on this page.
Where can I download the H616 devboard design files?
From the Kononenko-K/Allwinner_H616_Devboard repository on GitHub, which has the KiCad layout and the schematic; the links under Design files point to each one.
Can I use the H616 devboard design in my own project?
Yes, under the terms of its CERN-OHL-P-2.0 license, which Kononenko-K chose for the repository.
Can I test firmware for the H616 devboard without the hardware?
Yes. HardLabs builds a simulation of the board from its netlist and BOM, so you can run and debug STM32 firmware against it before you order a PCB.
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