Low power module
Terrapin-Rocket-Team·SRAD-Avionics·Spaceport/PCBs/low_power_module/low_power_module.kicad_pcb
About the Low power module
Low power module is an open source NXP PCB design by Terrapin-Rocket-Team, published on GitHub. It is a 2-layer board measuring 58.8 × 63.1 mm, with 49 components from 23 distinct parts.
Its main chip is the Teensy_4.1, from the NXP family. Other key parts include the Si4463. By type, the board carries 9 LEDs, 9 resistors, 3 connectors, 3 capacitors, 1 IC and 1 buzzer.
From the project
Code and PCBs for the avionics subteam for the SRAD flight computer and side projects
The avionics subteam manages this repo, as well as the Multi-Mission-Flight-Software and Ground Station repositories. Look at the Issues tab for tasks that need to be done, and the Projects tab for the current status of the Avionics subteam as a whole.
Most of our development for our competition rocket systems will be within the /Spaceport/ directory. Here, the parts are broken up by whether they are hardware, PCBs, or code.
Main components on the Low power module
Low power module bill of materials (BOM)
49 components, 23 distinct parts — part numbers from the project's BOM.
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 1 | Si4463 | QFN-20-1EP_4x4mm_P0.5mm_EP2.6x2.6mm_ThermalVias | U1 |
| 1 | SMA | SMA_EDGELAUNCH | J1 |
| 2 | Conn_01x03_Pin | PinHeader_1x03_P2.54mm_Vertical | J2, J3 |
| 1 | Buzzer | Adafruit_5V_Buzzer | BZ1 |
| 1 | 10nF | C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | CB0 |
| 3 | 1u | C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | CB1, CB2, CB3 |
| 3 | 10uF | C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | CD0, CD1, CD2 |
| 4 | 22pF | C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | CM1, CM2, CM3, CM5 |
| 1 | 15pF | C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | CM4 |
| 1 | 4.7pF | C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | CR1 |
| 1 | 2.2pF | C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | CR2 |
| 1 | 220nH | L_0805_2012Metric_Pad1.15x1.40mm_HandSolder | LChoke1 |
| 2 | 10nH | L_0805_2012Metric_Pad1.15x1.40mm_HandSolder | LM1, LM3 |
| 1 | 62nH | L_0603_1608Metric_Pad1.05x0.95mm_HandSolder | LR1 |
| 1 | 56nH | L_0805_2012Metric_Pad1.15x1.40mm_HandSolder | LR2 |
| 1 | CG2409M2 | CG2409M2 | RFS1 |
| 1 | TG2520SMN | TG2520SMN | TCXO2 |
| 1 | ~ | Teensy_4.1 | Teensy4.1 |
| 9 | LED | LED_0805_2012Metric_Pad1.15x1.40mm_HandSolder | CS1, GPIO0, GPIO1, GPIO2, GPIO3, IRQ1, SDN1, STAT1 +1 |
| 1 | 33nH | L_0805_2012Metric_Pad1.15x1.40mm_HandSolder | L0 |
Show 3 more
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 1 | 9.1pF | C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | C0 |
| 2 | 1uF | C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | C8, C9 |
| 9 | 1k | R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R1, R2, R3, R4, R5, R6, R7, R8 +1 |
Low power module design files
The KiCad project lives in the Terrapin-Rocket-Team/SRAD-Avionics repository on GitHub; these links point at the commit this page was built from.
Low power module: common questions
What microcontroller does the Low power module use?
The Low power module is built around the Teensy_4.1, from the NXP family.
How big is the Low power module?
The Low power module measures 58.8 × 63.1 mm, has 2 copper layers and is 1.6 mm thick.
How many components are on the Low power module?
49 components, from 23 distinct parts, with part numbers taken from the project's own BOM. The full bill of materials is listed on this page.
Where can I download the Low power module design files?
From the Terrapin-Rocket-Team/SRAD-Avionics repository on GitHub, which has the KiCad layout, the schematic and the BOM; the links under Design files point to each one.
Can I use the Low power module design in my own project?
The repository has no license, so all rights stay with Terrapin-Rocket-Team. Use it as a reference, and ask the author before reusing the design.
Can I test firmware for the Low power module without the hardware?
Yes. HardLabs builds a simulation of the board from its netlist and BOM, so you can run and debug NXP firmware against it before you order a PCB.
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