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High power module

Terrapin-Rocket-Team·SRAD-Avionics·Spaceport/PCBs/high-power-module/high-power-module.kicad_pcb

High power module layout, top view — open source STM32 board by Terrapin-Rocket-Team
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About the High power module

High power module is an open source STM32 PCB design by Terrapin-Rocket-Team, published on GitHub. It is a 4-layer board measuring 38 × 43.6 mm, with 83 components from 54 distinct parts.

Its main chip is the TPS62A03DRLR, from the STM32 family. Other key parts include the MS5611-01BA, BMI088, H3LIS331DL and SAM-M10Q-00B. By type, the board carries 14 resistors, 11 capacitors, 6 ICs, 5 connectors, 5 LEDs and 5 inductors.

From the project

Code and PCBs for the avionics subteam for the SRAD flight computer and side projects

The avionics subteam manages this repo, as well as the Multi-Mission-Flight-Software and Ground Station repositories. Look at the Issues tab for tasks that need to be done, and the Projects tab for the current status of the Avionics subteam as a whole.

Most of our development for our competition rocket systems will be within the /Spaceport/ directory. Here, the parts are broken up by whether they are hardware, PCBs, or code.

Main components on the High power module

MS5611-01BABMI088H3LIS331DLSAM-M10Q-00BTPS62A03DRLR

High power module bill of materials (BOM)

83 components, 54 distinct parts — part numbers from the project's BOM.

QtyPartRefs
1
MS5611-01BA
Si4463
U1
1
BMI088
SN74LV1T08QDBVRQ1
U2
1
H3LIS331DL
MCP1703AT-3302E/MB
U3
1
~
U4
1
SAM-M10Q-00B
~
U5
1
TPS62A03DRLR
STM32F103C8Tx
U6
3
PMOS
Q1, Q2, Q3
1
Conn_01x06_Pin
J1
1
CONN_01X02
SMA
J2
1
CONN_01X02
Conn_01x06_Pin
J3
1
Conn_01x04_Pin
J5
1
I2C
UART
J7
3
1uF
CB1, CB2, CB4
1
10nF
CB3
1
0.1uF
CB5
3
10uF
CD1, CD2, CD3
1
4.7u
CD4
2
10n
CD5, CD6
8
22pF
CM1, CM2, CM4, CM5, CM6, CM7, CM8, CM9
1
6.2pF
CM3
Show 34 more
QtyPartRefs
1
4.7pF
CR1
1
2.2pF
CR2
1
220nH
LChoke1
4
11nH
LM1, LM2, LM5, LM6
1
18nH
LM4
1
62nH
LR1
1
56nH
LR2
1
~
PA1
1
CG2409M2
RFS1
1
TG2520SMN
TCXO1
5
LED
3V3, 5V0, GP2, GP3, IRQ1
1
SM05T1G
D1
1
Wurth 7427931
FB1
1
15nH
L0
1
2.2UH
3.3nH
L1
1
56nH
L2
1
1UH
3.0nH
L3
1
9.1pF
C0
4
1uF
C1, C7, C8, C9
1
36pF
C2
1
100pF
C3
1
0.1uF
C4
2
10uF
C5, C10
1
39pF
C6
1
280
R1
1
100k
R2
1
68nH
R3
4
5.1k
R4, R5, R6, R10
2
10k
R7, R15
1
15K
5.1k
R12
1
111K
215
R13
1
28.7K
10k
R14
1
500K
10k
R16
1
100K
100M
R17

High power module design files

The KiCad project lives in the Terrapin-Rocket-Team/SRAD-Avionics repository on GitHub; these links point at the commit this page was built from.

High power module: common questions

What microcontroller does the High power module use?

The High power module is built around the TPS62A03DRLR, from the STM32 family.

How big is the High power module?

The High power module measures 38 × 43.6 mm, has 4 copper layers and is 1.5842 mm thick.

How many components are on the High power module?

83 components, from 54 distinct parts, with part numbers taken from the project's own BOM. The full bill of materials is listed on this page.

Where can I download the High power module design files?

From the Terrapin-Rocket-Team/SRAD-Avionics repository on GitHub, which has the KiCad layout, the schematic and the BOM; the links under Design files point to each one.

Can I use the High power module design in my own project?

The repository has no license, so all rights stay with Terrapin-Rocket-Team. Use it as a reference, and ask the author before reusing the design.

Can I test firmware for the High power module without the hardware?

Yes. HardLabs builds a simulation of the board from its netlist and BOM, so you can run and debug STM32 firmware against it before you order a PCB.

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