HardLabs

PROC091F

um-kiho·ti_radar·hardware/pcb/sprr418a/sprr418/Rev.F/kicad/PROC091F.kicad_pcb

PROC091F PCB layout, top view — open source TI MSP430/CC board by um-kiho

About the PROC091F PCB

PROC091F is an open source TI MSP430/CC PCB design by um-kiho, published on GitHub. It is a 8-layer board measuring 1.9 × 1.9 mm, with 414 components from 89 distinct parts.

Its main chip is the CC2642R1FRGZR, from the TI MSP430/CC family. Other key parts include the LP87524JRNFRQ1, XI6843ARQGALP, CP2105-F01-GMR, TPS79330DBVR and TMP112AQDRLRQ1. By type, the board carries 160 resistors, 125 capacitors, 22 test points, 19 ICs, 14 inductors and 10 connectors.

It belongs with the iot & wireless and usb & debug tools designs in this gallery.

From the project

AWR6843AOP (Antenna-on-Package) 60GHz FMCW 레이더를 이용한 존재 감지(Presence Detection) 시스템입니다. 내장 ARM Cortex-R4F MCU + C674x DSP에서 신호 처리 및 존재 판정을 수행하고, UART로 결과를 출력합니다.

AWR6843AOP (Antenna-on-Package) 60GHz FMCW 레이더를 이용한 존재 감지(Presence Detection) 시스템입니다. 내장 ARM Cortex-R4F MCU + C674x DSP에서 신호 처리 및 존재 판정을 수행하고, UART로 결과를 출력합니다.

1. AWR6843AOP EVM (BOOST-AWR6843AOPEVM) - TI 공식 평가 보드 - USB 연결로 전원 공급 + UART 통신 - 구매: TI Store

2. MMWAVEICBOOST (캐리어 보드) (선택) - EVM과 함께 사용하는 인터페이스 보드 - JTAG 디버깅, 추가 UART 포트 제공

4. BLE 모듈 (선택, Wi-Fi/BLE 출력 시) - CC2642R SimpleLink BLE 모듈 권장 - UART로 AWR6843AOP와 연결

Main components on the PROC091F

LP87524JRNFRQ1XI6843ARQGALPCP2105-F01-GMRTPS79330DBVRTMP112AQDRLRQ1CAT24C08TDI-GT3BNO085CC2642R1FRGZRMX25R1635FZUIH0TCA6408ARSVRSN74LVC1G3157DSFRTCAN1042HGVDRBRQ1TS3A5018RSVRTXB0104QRUTRQ1TS5A23157RSERSN74LVC1G11DSFRTPS2115ADRBRANT016008LCS2442MA2

PROC091F bill of materials (BOM)

414 components, 89 distinct parts.

QtyPartRefs
1
LP87524JRNFRQ1
U1
1
XI6843ARQGALP
U2
1
CP2105-F01-GMR
U3
1
TPS79330DBVR
U4
1
TMP112AQDRLRQ1
U5
1
CAT24C08TDI-GT3
U6
1
BNO085
U7
1
CC2642R1FRGZR
U8
1
MX25R1635FZUIH0
U9
1
TCA6408ARSVR
U10
1
SN74LVC1G3157DSFR
U11
2
TCAN1042HGVDRBRQ1
U12, U17
1
TS3A5018RSVR
U13
1
TXB0104QRUTRQ1
U14
2
TS5A23157RSER
U15, U18
1
SN74LVC1G11DSFR
U16
1
TPS2115ADRBR
U19
1
ANT016008LCS2442MA2
A1
1
BSS123-7-F
Q1
1
CX2016DB40000D0FLJCC
Y1
Show 69 more
QtyPartRefs
1
CX2016DB48000C0WPLA2
Y2
2
ABS05W-32.768KHZ-D-2-T
Y3, Y4
2
105017-0001
J1, J5
1
QSH-030-01-L-D-A
J2
1
M50-3930442
J3
2
51441-1093
J4, J6
1
GRPB052MWCN-RC
J7
2
M50-3930342
J8, J10
1
U.FL-R-SMT-1(01)
J9
4
Comment
Designator1, Designator6, Designator7, Designator8
11
BRAKE_WAY_HOLES1X2
Designator1_1, Designator2, Designator2_1, Designator3, Designator3_1, Designator4, Designator4_1, Designator5 +3
2
Comment
Designator22_1, Designator23
13
BLM15PD300SZ1D
FL1, FL2, FL3, FL6, FL7, FL8, FL9, FL10 +5
6
APHHS1005CGCK
LD1, LD2, LD3, LD4, LD5, LD6
9
EXB-18VR000X
RA1, RA2, RA3, RA4, RA5, RA6, RA7, RA8 +1
2
218-4LPST
S1, S2
1
CHS-01TA
S3
2
B3U-1000P
SW2, SW3
20
N/A
TESTPOINT
TP2, TP3, TP4, TP5, TP6, TP7, TP8, TP9 +12
1
N/A
TESTPOINT
TP12
1
4953
TP20
1
This Assembly Note is for PCB labels only
ZZ1
1
These assemblies are ESD sensitive, ESD precautions shall be observed.
ZZ2
1
These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
ZZ3
1
These assemblies must comply with workmanship standards IPC-A-610 Class 2, unless otherwise specified.
ZZ4
1
Cut the thermal pad(Part Number#GPVOUS-0.125-AC-0816) for the shape and size of the inner surface of the heatsink(Part Number#MCH054) and paste it on the inner surface of the heatsink;
ZZ5.1
1
Bring the heatsink onto the PCB bottom side (Opposite side of AOP device). Match the teeth in the heatsink with break-away area in the PCB and press the heatsink onto the PCB slightly so as thermal pad is spread all over the area
ZZ5.2
2
NSR20F30NXT5G
D1, D2
2
LQG15HS2N4S02D
L1, L6
4
MCKK2012TR47M
L2, L3, L4, L5
1
MLZ2012N6R8LT000
L7
1
BLM18HE152SN1D
L8
2
LQG15HS2N0S02D
L9, L10
4
BLM18SG260TN1D
L11, L12, L13, L14
17
CL05A106MP5NUNC
C1, C4, C7, C42, C50, C51, C52, C53 +9
34
GRM033R6YA104KE14D
C2, C3, C6, C9, C10, C12, C13, C25 +26
9
CL03A105MO3NRNH
C5, C11, C15, C16, C24, C100, C115, C116 +1
2
CL03A103KA3NNNC
C8, C125
2
GRM0335C1H4R7BA01D
C14, C71
2
GRM0335C1H8R0BA01D
C17, C18
4
250R05L120JV4T
C19, C20, C38, C39
2
CL05C120JB5NNNC
C21, C93
3
GCM1555C1H1R0CA16D
C22, C23, C41
10
CL05A226MQ5N6J8
C28, C29, C44, C45, C46, C47, C48, C49 +2
24
LMK063BJ224MP-F
C30, C56, C57, C58, C60, C61, C63, C64 +16
4
TMK063CG391JT-F
C31, C32, C33, C34
1
GRM033R61C473KE84D
C69
5
CL03A225MQ3CRNC
C74, C79, C83, C102, C103
2
CGB2A1X6S0J105K033BC
C89, C90
2
GJM1555C1H1R8BB01D
C99, C104
2
GRM155R71H472KA01D
C106, C110
39
RR0306P-103-D
R1, R3, R7, R8, R18, R19, R20, R21 +31
20
RC0201JR-070RL
R2, R12, R14, R28, R30, R31, R32, R41 +12
7
CRCW0201100KFKED
R4, R5, R9, R29, R37, R89, R92
5
CRCW020133R2FNED
R6, R46, R47, R48, R49
10
AC0201FR-0720RL
R10, R11, R88, R130, R132, R133, R135, R137 +2
5
RC0201JR-07220RL
R13, R15, R17, R42, R111
3
RC0201FR-077K87L
R16, R174, R176
1
CRCW0402200RFKEDHP
R24
9
RC0201FR-074K99L
R25, R26, R33, R34, R38, R40, R64, R69 +1
4
RC0201JR-07510RL
R27, R39, R107, R108
2
RC0201JR-071KL
R50, R75
1
RC0201FR-071K96L
R52
4
RC0402FR-073R83L
R53, R54, R55, R56
38
RC0201JR-070RL
R66, R72, R73, R74, R76, R86, R87, R90 +30
3
ERJ-1GNF4701C
R79, R180, R181
4
CRCW040261R9FKED
R114, R117, R119, R126
3
RC0201FR-0782K5L
R158, R170, R172
2
RC0201JR-07750RL
R159, R171

PROC091F design files

The KiCad project lives in the um-kiho/ti_radar repository on GitHub; these links point at the commit this page was built from.

PROC091F: common questions

What microcontroller does the PROC091F use?

The PROC091F is built around the CC2642R1FRGZR, from the TI MSP430/CC family.

How big is the PROC091F PCB?

The PROC091F measures 1.9 × 1.9 mm, has 8 copper layers and is 1.6239 mm thick.

How many components are on the PROC091F?

414 components, from 89 distinct parts. The full bill of materials is listed on this page.

Where can I download the PROC091F design files?

From the um-kiho/ti_radar repository on GitHub, which has the KiCad layout and the schematic; the links under Design files point to each one.

Can I use the PROC091F design in my own project?

The repository has no license, so all rights stay with um-kiho. Use it as a reference, and ask the author before reusing the design.

Can I test firmware for the PROC091F without the hardware?

Yes. HardLabs builds a simulation of the board from its netlist and BOM, so you can run and debug TI MSP430/CC firmware against it before you order a PCB.

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