CheeseDip
upsidedownlabs·MSP430-Breadstick·CheeseDip/CheeseDip.kicad_pcb
About the CheeseDip PCB
CheeseDip is an open source TI MSP430/CC PCB design by upsidedownlabs, published on GitHub under the CERN-OHL-S-2.0 license. It is a 2-layer board measuring 21.6 × 60 mm, with 27 components from 17 distinct parts.
Its main chip is the MSP430G2553IPW28, from the TI MSP430/CC family. Other key parts include the TLV74033PDBVR / ME6211 and CH340C. By type, the board carries 7 capacitors, 5 resistors, 4 connectors, 4 diodes, 3 ICs and 3 switches.
It belongs with the dev boards & breakouts, usb & debug tools and test & measurement designs in this gallery.
From the project
Texas Instrument MSP430G2553 based development board.
Upside Down Labs MSP430 Breadstick is a development board for ultra low power MSP430G2553 MCU from Texas Instruments.

Main components on the CheeseDip
CheeseDip bill of materials (BOM)
27 components, 17 distinct parts.
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 1 | MSP430G2553IPW28 | MSP430G2553IPW28 | IC1 |
| 1 | TLV74033PDBVR / ME6211 | TLV74033PDBVR | IC3 |
| 1 | CH340C | SOIC-16_3.9x9.9mm_P1.27mm | U1 |
| 1 | Conn_02x06_Counter_Clockwise | progMSP | J1 |
| 2 | Conn_01x14 | PinHeader_1x14_P2.54mm_Vertical | J2, J5 |
| 1 | USB_C_Receptacle_USB2.0 | USB_C_Receptacle_HRO_TYPE-C-31-M-12 | J3 |
| 2 | SW_SPST | SW_SPST_SKQG_WithStem | SW1, SW3 |
| 1 | SS-3235S-L3 | SS-3235S-L3 | SW2 |
| 1 | USR LED | LED_0603_1608Metric_Pad1.05x0.95mm_HandSolder | D1 |
| 1 | RX LED | LED_0603_1608Metric_Pad1.05x0.95mm_HandSolder | D2 |
| 1 | PWR LED | LED_0603_1608Metric_Pad1.05x0.95mm_HandSolder | D3 |
| 1 | TX LED | LED_0603_1608Metric_Pad1.05x0.95mm_HandSolder | D4 |
| 1 | Ferrite_Bead_Small | L_0805_2012Metric_Pad1.15x1.40mm_HandSolder | FB1 |
| 5 | 100nF | C_0603_1608Metric_Pad1.08x0.95mm_HandSolder | C1, C3, C4, C6, C8 |
| 2 | 10uF | C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | C2, C7 |
| 4 | 1k | R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R1, R2, R3, R4 |
| 1 | 10k | R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R5 |
CheeseDip design files
The KiCad project lives in the upsidedownlabs/MSP430-Breadstick repository on GitHub; these links point at the commit this page was built from.
CheeseDip: common questions
What microcontroller does the CheeseDip use?
The CheeseDip is built around the MSP430G2553IPW28, from the TI MSP430/CC family.
How big is the CheeseDip PCB?
The CheeseDip measures 21.6 × 60 mm, has 2 copper layers and is 1.6 mm thick.
How many components are on the CheeseDip?
27 components, from 17 distinct parts. The full bill of materials is listed on this page.
Where can I download the CheeseDip design files?
From the upsidedownlabs/MSP430-Breadstick repository on GitHub, which has the KiCad layout; the links under Design files point to each one.
Can I use the CheeseDip design in my own project?
Yes, under the terms of its CERN-OHL-S-2.0 license, which upsidedownlabs chose for the repository.
Can I test firmware for the CheeseDip without the hardware?
Yes. HardLabs builds a simulation of the board from its netlist and BOM, so you can run and debug TI MSP430/CC firmware against it before you order a PCB.
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