Avionics ground
About the Avionics ground PCB
Avionics ground is an open source NXP PCB design by usfsoar, published on GitHub. It is a 2-layer board measuring 86.4 × 59.3 mm, with 21 components from 16 distinct parts.
Its main chip is the Teensy4.0, from the NXP family. Other key parts include the RFM95W-915S2, NHD-0420H1Z, LM386, LT1129-5.0_SOT223 and LT1129-3.3_SOT223. By type, the board carries 7 ICs, 4 capacitors, 3 connectors, 3 resistors, 1 speaker and 1 switch.
It belongs with the rf & radio and science & space designs in this gallery.
From the project
KiCad project for the PCB in the payload of SOAR's IREC Rocket
This is the PCB for the payload of USF Society of Aeronautics and Rocketry's 2019 IREC rocket. The PCB is made in KiCad (pronounced key-cad). The different two parts of the payload are split into the folders payloadgroundpcb, the ground station, and payloadmainpcb, the cubesat payload, under those there are the files are:
avionics-\.pro - This is the base project which you should open in KiCad. avionics-\.sch - This is the sketch of the PCB and shows which components should be connected where. avionics-\.kicadpcb - This is the actual PCB that has the components laid out and connected with…
Main components on the Avionics ground
Avionics ground bill of materials (BOM)
21 components, 16 distinct parts.
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 1 | Teensy4.0 | Teensy40 | U1 |
| 1 | RFM95W-915S2 | HOPERF_RFM9XW_SMD | U2 |
| 1 | NHD-0420H1Z | NHD-0420H1Z | U3 |
| 1 | LM386 | DIP-8_W7.62mm_SMDSocket_SmallPads | U4 |
| 1 | LT1129-5.0_SOT223 | SOT-223-3_TabPin2 | U5 |
| 1 | LT1129-3.3_SOT223 | SOT-223-3_TabPin2 | U6 |
| 1 | ublox_SAM-M8Q | ublox_SAM-M8Q | U7 |
| 1 | Micro_SD_Card | microSD_HC_Wuerth_693072010801 | J1 |
| 1 | Conn_Coaxial | SMA_Amphenol_132134-14_Vertical | J2 |
| 1 | USB_B_Micro | USB_Mini-B_Lumberg_2486_01_Horizontal | J3 |
| 1 | Speaker | Buzzer_Murata_PKMCS0909E4000-R1 | LS1 |
| 2 | R_POT | Potentiometer_ACP_CA6-VSMD_Vertical_Hole | RV1, RV2 |
| 1 | SW_Push | SW_PUSH_6mm | SW1 |
| 2 | CP1_Small | CP_EIA-1608-08_AVX-J_Pad1.25x1.05mm_HandSolder | C1, C2 |
| 2 | 3.3uF | CP_EIA-1608-08_AVX-J_Pad1.25x1.05mm_HandSolder | C3, C4 |
| 3 | R | R_0805_2012Metric_Pad1.15x1.40mm_HandSolder | R1, R2, R3 |
Avionics ground design files
The KiCad project lives in the usfsoar/irec-avionics-payload-pcb repository on GitHub; these links point at the commit this page was built from.
Avionics ground: common questions
What microcontroller does the Avionics ground use?
The Avionics ground is built around the Teensy4.0, from the NXP family.
How big is the Avionics ground PCB?
The Avionics ground measures 86.4 × 59.3 mm, has 2 copper layers and is 1.6 mm thick.
How many components are on the Avionics ground?
21 components, from 16 distinct parts. The full bill of materials is listed on this page.
Where can I download the Avionics ground design files?
From the usfsoar/irec-avionics-payload-pcb repository on GitHub, which has the KiCad layout; the links under Design files point to each one.
Can I use the Avionics ground design in my own project?
The repository has no license, so all rights stay with usfsoar. Use it as a reference, and ask the author before reusing the design.
Can I test firmware for the Avionics ground without the hardware?
Yes. HardLabs builds a simulation of the board from its netlist and BOM, so you can run and debug NXP firmware against it before you order a PCB.
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