Default.active pre v0.2-hydration
About the Default.active pre v0.2-hydration PCB
Default.active pre v0.2-hydration is an open source STM32 PCB design by RileyLeff, published on GitHub. It is a 6-layer board measuring 100 × 65 mm, with 234 components from 55 distinct parts.
Its main chip is the STM32G0B1CBT6, from the STM32 family. Other key parts include the 74HC4067PW,118, LM5165YDRCR, ADS1115IDGSR, SP3485EN-L/TR and 2920L110/60MR. By type, the board carries 91 capacitors, 87 resistors, 20 diodes, 13 ICs, 7 transistors and 6 connectors.
It belongs with the sensors designs in this gallery.
From the project
Created 2026-06-22 before hydrating the active KiCad layout for v0.2 input protection work.
Created 2026-06-22 before hydrating the active KiCad layout for v0.2 input protection work.
- default.shipped-v0.1.kicadpcb: exact copy of the archived JLC-shipped PCB layout from ../sap-flux-adapter-v1.1-shipped-2026-03-21/default.kicadpcb. This is the canonical shipped board layout, despite the archive directory using the v1.1 release name; the board artwork itself is labeled v0.1. - default.active-pre-v0.2-hydration.kicadpcb: copy of ../../elec/layouts/default/default.kicadpcb immediately before replacing it with the Atopile-generated v0.2 layout.
Main components on the Default.active pre v0.2-hydration
Default.active pre v0.2-hydration bill of materials (BOM)
234 components, 55 distinct parts — part numbers from the project's BOM.
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 3 | 74HC4067PW,118 C179326 Nexperia | TSSOP-24_L7.8-W4.4-P0.65-LS6.4-BL | U1, U5, U11 |
| 1 | LM5165YDRCR C2071924 Texas Instruments | VSON-10_L3.0-W3.0-P0.50-TL-EP | U2 |
| 1 | STM32G0B1CBT6 C2847904 STMicroelectronics | LQFP-48_L7.0-W7.0-P0.50-LS9.0-BL | U3 |
| 1 | ADS1115IDGSR C37593 Texas Instruments | MSOP-10_L3.0-W3.0-P0.50-LS5.0-BL | U4 |
| 1 | SP3485EN-L/TR C8963 MaxLinear | SOIC-8_L5.0-W4.0-P1.27-LS6.0-BL | U6 |
| 1 | 2920L110/60MR C315903 Littelfuse | F2920 | U7 |
| 1 | TPL5010DDCR C473912 Texas Instruments | SOT-23-6_L2.9-W1.6-P0.95-LS2.8-BR | U8 |
| 1 | CAT24C32WI-GT3 C81193 onsemi | SOIC-8_L5.0-W4.0-P1.27-LS6.0-BL | U9 |
| 1 | XL-B1212RGBA-HF C22461780 XINGLIGHT | LED-SMD_4P-L1.2-W1.2_BR | U10 |
| 1 | VP1H101M0607 C4054386 Honor Elec | CAP-SMD_BD6.3-L6.6-W6.6-LS7.2-FD | U12 |
| 1 | W25Q256JVFIQ C779876 Winbond Elec | SOIC-16_L10.3-W7.5-P1.27-LS10.3-BL | U13 |
| 1 | TM15N10D C7422818 Tritech-MOS | TO-252-2_L6.6-W6.2-P4.57-LS10.1-BR-CW | Q1 |
| 1 | SS8550 Y2(RANGE:200-350) C8542 Changjiang Electronics Tech | SOT-23-3_L2.9-W1.3-P1.90-LS2.4-BR | Q2 |
| 1 | MMBT3904(RANGE:100-300) C20526 Changjiang Electronics Tech | SOT-23-3_L2.9-W1.3-P1.90-LS2.4-BR | Q3 |
| 4 | 2N7002 C8545 Changjiang Electronics Tech | SOT-23-3_L2.9-W1.3-P1.90-LS2.4-BR | Q4, Q5, Q6, Q7 |
| 1 | Q13FC13500004 C32346 Seiko Epson | FC-135R_L3.2-W1.5 | Y1 |
| 2 | KF2EDGV-3.5-2P C441321 Cixi Kefa Elec | CONN-TH_P3.50_KF2EDGV-3.5-2P | CN1, J1 |
| 1 | X6521WV-2x30H-C60D30 C2883964 XKB Connectivity | HDR-TH_60P-P2.54-V-M-R2-C30-S2.54 | CN2 |
| 1 | 2.54-1x6P直针 C37208 BOOMELE | HDR-TH_6P-P2.54-V-M-1 | J2 |
| 1 | KF2EDGV-3.5-3P C441322 Cixi Kefa Elec | CONN-TH_3P-P3.50_KF2EDGV-3.5-3P | J3 |
Show 35 more
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 1 | PZ254V-11-04P C2691448 XFCN | HDR-TH_4P-P2.54-V-M | J4 |
| 1 | BS-CR2032-8 C7498149 Lian Xin Technology | BAT-SMD_BS-CR2032-8 | BAT1 |
| 1 | 5x20 环保 保险管夹/座 C19727305 Xucheng Elec | FUSE-TH_5X20RHOSFUSECLIP-SEAT | F1 |
| 1 | 5x20 环保 保险管夹/座 Xucheng Elec | FUSE-TH_5X20RHOSFUSECLIP-SEAT | F2 |
| 3 | ToolingHole | ToolingHole_1.152mm | TH1, TH2, TH3 |
| 13 | PRTR5V0U4D-TP C2835429 TECH PUBLIC | SOT-23-6_L2.9-W1.6-P0.95-LS2.8-BR | D1, D3, D4, D8, D9, D10, D11, D12 +5 |
| 1 | SMAJ33A C19077549 FTR | SMA_L4.3-W2.6-LS5.0-RD | D2 |
| 1 | SM712 C7420375 hongjiacheng | SOT-23-3_L2.9-W1.3-P1.90-LS2.4-BR | D5 |
| 1 | SS36 C16015 MDD（Microdiode Electronics） | SMA_L4.3-W2.6-LS5.2-RD | D6 |
| 1 | 1N4148WS C2128 Changjiang Electronics Tech | SOD-323_L1.8-W1.3-LS2.5-RD | D7 |
| 1 | SS56 C18199169 hongjiacheng | SMA_L4.3-W2.6-LS5.0-RD | D18 |
| 1 | MM3Z10 C19077459 hongjiacheng | SOD-323_L1.7-W1.3-LS2.6-RD | D19 |
| 1 | BAT54C C22466350 hongjiacheng | SOT-23-3_L2.9-W1.3-P1.90-LS2.4-BR | D20 |
| 1 | XRNR4018-68uH/M C5289353 XR | IND-SMD_L4.0-W4.0 | L1 |
| 2 | GZ1608D601TF C1002 Sunlord | L0603 | L2, L3 |
| 1 | 1206B475K500NT C29823 FH | C1206 | C1 |
| 78 | CC0603KRX7R9BB104 C14663 YAGEO | C0603 | C2, C5, C6, C8, C9, C10, C12, C13 +70 |
| 1 | C2012X5R1A226KT000N C76634 TDK | C0805 | C3 |
| 5 | CL10A105KB8NNNC C15849 Samsung Electro-Mechanics | C0603 | C4, C20, C28, C86, C88 |
| 2 | GRM21BR61H106KE43L C440198 Murata Electronics | C0805 | C7, C91 |
| 2 | CL05B104KO5NNNC 0F Samsung Electro-Mechanics | C0402 | C11, C22 |
| 2 | 0402CG180J500NT C1549 FH | C0402 | C89, C90 |
| 1 | FRC0603F2492TS 24.9kΩ FOJAN | R0603 | R1 |
| 10 | 0603WAF1002T5E 10000Ω UNI-ROYAL(Uniroyal Elec) | R0603 | R2, R21, R26, R33, R74, R75, R76, R79 +2 |
| 3 | 0402WGF1002TCE 10000Ω UNI-ROYAL(Uniroyal Elec) | R0402 | R3, R4, R5 |
| 53 | 0603WAF1001T5E 1000Ω UNI-ROYAL(Uniroyal Elec) | R0603 | R6, R7, R8, R9, R10, R11, R12, R13 +45 |
| 1 | FRC0603F2700TS 270Ω FOJAN | R0603 | R16 |
| 8 | 0603WAF1003T5E 100000Ω UNI-ROYAL(Uniroyal Elec) | R0603 | R17, R18, R23, R27, R28, R29, R81, R87 |
| 1 | 0603WAF1200T5E 120Ω UNI-ROYAL(Uniroyal Elec) | R0603 | R19 |
| 1 | 0603WAF1102T5E 11000Ω UNI-ROYAL(Uniroyal Elec) | R0603 | R22 |
| 5 | 0603WAF1004T5E 1000000Ω UNI-ROYAL(Uniroyal Elec) | R0603 | R25, R34, R83, R84, R86 |
| 1 | 0603WAF2200T5E 220Ω UNI-ROYAL(Uniroyal Elec) | R0603 | R30 |
| 1 | 0603WAF2000T5E 200Ω UNI-ROYAL(Uniroyal Elec) | R0603 | R31 |
| 1 | 0603WAF6800T5E 680Ω UNI-ROYAL(Uniroyal Elec) | R0603 | R32 |
| 1 | 0603WAF4704T5E C114606 UNI-ROYAL | R0603 | R80 |
Default.active pre v0.2-hydration design files
The KiCad project lives in the RileyLeff/sapflux_sensor repository on GitHub; these links point at the commit this page was built from.
Default.active pre v0.2-hydration: common questions
What microcontroller does the Default.active pre v0.2-hydration use?
The Default.active pre v0.2-hydration is built around the STM32G0B1CBT6, from the STM32 family.
How big is the Default.active pre v0.2-hydration PCB?
The Default.active pre v0.2-hydration measures 100 × 65 mm, has 6 copper layers and is 1.4204 mm thick.
How many components are on the Default.active pre v0.2-hydration?
234 components, from 55 distinct parts, with part numbers taken from the project's own BOM. The full bill of materials is listed on this page.
Where can I download the Default.active pre v0.2-hydration design files?
From the RileyLeff/sapflux_sensor repository on GitHub, which has the KiCad layout and the BOM; the links under Design files point to each one.
Can I use the Default.active pre v0.2-hydration design in my own project?
The repository has no license, so all rights stay with RileyLeff. Use it as a reference, and ask the author before reusing the design.
Can I test firmware for the Default.active pre v0.2-hydration without the hardware?
Yes. HardLabs builds a simulation of the board from its netlist and BOM, so you can run and debug STM32 firmware against it before you order a PCB.
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