RCM DishControllerBoard
jrseti·RCM_DishControllerBoard·kicad/rcm_dish_controller.kicad_pcb
About the RCM DishControllerBoard PCB
RCM DishControllerBoard is an open source STM32 PCB design by jrseti, published on GitHub under the MIT license. It is a 4-layer board measuring 140 × 100 mm, with 304 components from 111 distinct parts.
Its main chip is the STM32G474RET6, from the STM32 family. Other key parts include the LTC4311ISC6#TRPBF, LM75BIMX-3/NOPB, W25Q32JVSSIQ, MAX-M10S-00B and MP2322GQH-Z. By type, the board carries 97 resistors, 91 capacitors, 40 diodes, 18 ICs, 14 connectors and 8 test points.
It belongs with the rf & radio designs in this gallery.
From the project
PCB project creating a dish controller companion board for a Raspberry Pi Compute Module 4
A satellite dish motion controller with an on-board Raspberry Pi Compute Module 4.
This board carries the CM4 as the local host for the STM32-based two-axis motion controller, replacing the external PC/Pi that previously commanded the design over a long RS485 run.
Derived from the Axis Commander (jrdishaxiscontroller).
The Axis Commander's own history stays in the pcbs monorepo; this repo starts fresh rather than importing it. The baseline includes commit 9e2432b, which corrected the encoder input RC values that caused missed ticks at speed on V1.1.
Main components on the RCM DishControllerBoard
RCM DishControllerBoard bill of materials (BOM)
304 components, 111 distinct parts.
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 1 | STM32G474RET6 ST(意法半导体) | LQFP-64_L10.0-W10.0-P0.50-LS12.0-BL | U1 |
| 1 | LTC4311ISC6#TRPBF | SC-70-6_L2.2-W1.3-P0.65-LS2.2-BL | U2 |
| 1 | LM75BIMX-3/NOPB TI(德州仪器) | SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL | U3 |
| 1 | W25Q32JVSSIQ W25Q32JVSSIQ_C179173 Winbond(华邦) | SOIC-8_L5.3-W5.3-P1.27-LS8.0-BL | U4 |
| 1 | MAX-M10S-00B U-BLOX(优北罗) | SMD-18_L10.1-W9.7-P1.10-TL_SKG09F | U5 |
| 1 | MP2322GQH-Z | QFN-8_L2.0-W1.5-P0.50-BL | U6 |
| 1 | AP64501SP-13 DIODES(美台) | SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL-EP-1 | U7 |
| 2 | TPD4EUSB30DQAR TI(德州仪器) | USON-10_L2.5-W1.0-P0.50-BL | U8, U9 |
| 1 | AP22653W6-7 DIODES(美台) | SOT-23-6_L2.9-W1.6-P0.95-LS2.8-BR | U10 |
| 2 | TPD4EUSB30DQAR-N BORN(伯恩半导体) | DFN-10_L2.5-W1.0-P0.50-BL-A | U11, U14 |
| 1 | FSUSB42MUX onsemi(安森美) | MSOP-10_L3.0-W3.0-P0.50-LS5.0-BL | U12 |
| 1 | USB2514B-I/M2 MICROCHIP(美国微芯) | SQFN-36_L6.0-W6.0-P0.50-BL-EP | U13 |
| 2 | 74LVC1G07SE-7 DIODES(美台) | SC-88A_L2.0-W1.3-P0.65-LS2.1-BL | U15, U16 |
| 1 | 2541WV-2x12P 2541WV-2X12P HanElectricity(瀚源) | HDR-TH_24P-P2.54-V-M-R2-C12-S2.54 | U17 |
| 1 | ADM3057EBRWZ-RL ADI(亚德诺) | SOIC-20_L13.0-W7.6-P1.27-LS10.3-BL | U18 |
| 4 | BSS138 | SOT-23 | Q1, Q2, Q6, Q7 |
| 2 | DMP3013SFV-7(ES) DMP3013SFV-7 ElecSuper(静芯) | DFN-8_L3.3-W3.3-P0.65-BL | Q3, Q4 |
| 1 | AO3400A AOS | SOT-23-3_L2.9-W1.3-P1.90-LS2.4-BR | Q5 |
| 1 | NX2016SA-16MHZ-EXS00A-CS07826 | CRYSTAL-SMD_4P-L2.0-W1.6-BL | X1 |
| 1 | X322524MOB4SI YXC(扬兴晶振) | CRYSTAL-SMD_4P-L3.2-W2.5-BL | X2 |
Show 91 more
| Qty | Part | Footprint | Refs |
|---|---|---|---|
| 2 | KF2EDGR-2.54-9P | CONN-TH_9P-P2.54_KF2EDGR-2.54-9P | CN1, CN7 |
| 3 | KF2EDGR-2.54-6P KEFA(科发) | CONN-TH_KF2EDGR-2.54-6P | CN2, CN8, CN9 |
| 2 | SM04B-SRSS-TB (LF)(SN) | CONN-SMD_4P-P1.00_SM04B-SRSS-TB-LF-SN | CN3, CN4 |
| 1 | KF2EDGR-2.54-2P | CONN-TH_P2.54_KF2EDGR-2.54-2P | CN5 |
| 1 | SMA-KWE SMA-KWE_C7498154 LX(连欣科技) | SMA-TH_SMA-KWE_C7498154 | CN6 |
| 1 | KF2EDGR-2.54-3P KEFA(科发) | CONN-TH_3P-P2.54_KF2EDGR-2.54-3P | CN10 |
| 1 | Conn_ST_STDC14 | HDR-SMD_14P-P1.27_FTSH-107-01-L-DV-K | J1 |
| 1 | 2.54-2*3P针 Header-Male-2.54_2x3 BOOMELE(博穆精密) | HDR-TH_6P-P2.54-V-M-R2-C3-S2.54-1 | J2 |
| 1 | 2.54-1*3P针 Header-Male-2.54_1x3 BOOMELE(博穆精密) | HDR-TH_3P-P2.54-V-M-1 | J3 |
| 1 | 2.54-2*2P针 Header-Male-2.54_2x2 BOOMELE(博穆精密) | HDR-TH_4P-P2.54-V-M-R2-C2-S2.54-1 | J4 |
| 1 | MS621FE-FL11E | BAT_MS621FE-FL11E | BT1 |
| 1 | DC007B-2.5-J SHOU HAN(首韩) | DC-IN-TH_HX-DC007B-2.5 | DC1 |
| 2 | MF-USMF020-2 BOURNS | F1210 | F1, F2 |
| 1 | 1812L110/48QR LUTE(陆特) | F1812 | F3 |
| 1 | SMD1812P300TF/16 RUILON(瑞隆源) | F1812 | F4 |
| 4 | B-2100S02P-A110 210S-1*2P L=11.6MMGold-plated black Ckmtw(灿科盟) | HDR-TH_2P-P2.54-V-M-1 | H1, H2, H3, H4 |
| 1 | ComputeModule4-CM4 | Raspberry-Pi-4-Compute-Module | Module1 |
| 1 | LPJG0926HENL LPJG0926HENL_C22457393 LINK-PP(连普科技) | RJ45-TH_LPJG0926HENL_C22457393 | RJ1 |
| 1 | DSHP04TSGER | SW-SMD_8P-L6.7-W5.4-P1.27-LS8.4 | SW1 |
| 1 | SS-12F49-G050 | SW-TH_SS-12F45-GXXX | SW2 |
| 8 | RH-5016 荣和 | TESTPOINT-SMD_L3.0-W2.0 | TP1, TP2, TP3, TP4, TP5, TP6, TP7, TP8 |
| 1 | 907-111A1022D10200 Double layer DIP 90° black 精拓金 | USB-A-TH_USB-M-51 | USB1 |
| 1 | TYPE-C-31-M-12 韩国韩荣 | USB-C_SMD-TYPE-C-31-M-12_1 | USBC1 |
| 1 | LTST-S270KGKT | LED-SMD_L1.7-W0.6-RD | LED1 |
| 1 | KT-0805B XL-0805QBC KENTO | LED0805-R-RD | LED2 |
| 1 | KT-0805R RED KENTO | LED0805-R-RD | LED3 |
| 1 | KT-0805G GREEN KENTO | LED0805-R-RD | LED4 |
| 26 | TPESD0402G05V | D0402-BI | D1, D2, D3, D8, D9, D10, D11, D12 +18 |
| 8 | TPESD0402G15V TECH PUBLIC(台舟) | D0402-BI | D4, D5, D6, D7, D25, D26, D27, D28 |
| 1 | SMAJ14A hongjiacheng | D_SMA | D14 |
| 1 | SS14 MDD(辰达半导体) | SMA_L4.2-W2.6-LS5.0-RD_1 | D19 |
| 1 | 1N4148WS 1N4148WS T4 CJ(江苏长电/长晶) | SOD-323_L1.8-W1.3-LS2.5-RD | D20 |
| 1 | PESD0402-140 Littelfuse(美国力特) | D0402-BI | D21 |
| 1 | SMF6.0A hongjiacheng | D_SOD-123FL | D39 |
| 1 | NUP2105LT1G onsemi(安森美) | SOT-23-3_L2.9-W1.3-P1.90-LS2.4-BL-2 | D40 |
| 1 | BLM18AG601SN1D muRata(村田) | L0603 | L1 |
| 1 | LQG15HS27NJ02D muRata(村田) | L0402-RD | L2 |
| 1 | 3.3uH | IND-SMD_L3.0-W3.0-1 | L3 |
| 1 | SRN6045TA-3R3Y BOURNS | IND-SMD_L6.0-W6.0 | L4 |
| 2 | BLM15HD182SN1D muRata(村田) | L0402 | L5, L6 |
| 1 | SMW2012B371BTE 370R@100MHz Sunltech(顺磁) | FILTER-SMD_4P-L2.0-W1.2-BL | L7 |
| 1 | 4.7uF Samsung Electro-Mechanics | C_0603 | C1 |
| 21 | 100nF Samsung Electro-Mechanics | C_0402 | C2, C3, C4, C5, C6, C9, C11, C12 +13 |
| 2 | 10nF Samsung Electro-Mechanics | C_0402 | C7, C26 |
| 3 | 1uF Samsung Electro-Mechanics | C_0402 | C8, C10, C50 |
| 2 | 6.8pF FH(Guangdong Fenghua Advanced Tech) | C_0402 | C13, C14 |
| 6 | 1nF FH(Guangdong Fenghua Advanced Tech) | C_0402 | C15, C16, C17, C34, C35, C36 |
| 5 | 10nF FH(Guangdong Fenghua Advanced Tech) | C_0603 | C18, C19, C33, C37, C38 |
| 1 | JVJ35V220M6x8 220uF JIERR(捷而瑞) | CAP-SMD_BD6.3-L6.6-W6.6-FD | C20 |
| 1 | 4.7uF Samsung Electro-Mechanics | C_0402 | C21 |
| 2 | 10uF Samsung Electro-Mechanics | C_0603 | C24, C29 |
| 1 | 1uF Samsung Electro-Mechanics | C_0603 | C28 |
| 3 | 100nF YAGEO | C_0603 | C30, C31, C47 |
| 1 | 47pF Samsung Electro-Mechanics | C_0603 | C32 |
| 2 | 100nF Samsung Electro-Mechanics | C0805 | C43, C51 |
| 2 | 10uF Murata Electronics | C_0805 | C45, C46 |
| 1 | 22pF Samsung Electro-Mechanics | C_0603 | C48 |
| 1 | 22uF Samsung Electro-Mechanics | C_0805 | C49 |
| 11 | CL21B106KPQNNNE 10uF 10V SAMSUNG(三星) | C0805 | C53, C54, C55, C56, C69, C71, C72, C73 +3 |
| 2 | EEFCX0J101R 100uF 6.3V PANASONIC | CP_EIA-7343-31_Kemet-D | C57, C70 |
| 6 | GRM21BC8YA106KE11L 10uF 35V muRata(村田) | C0805 | C59, C60, C61, C62, C63, C64 |
| 1 | CC0402KRX7R9BB122 1.2nF YAGEO(国巨) | C0402 | C67 |
| 2 | 15pF FH(Guangdong Fenghua Advanced Tech) | C_0402 | C75, C76 |
| 5 | 100n | C_0402_1005Metric | C80, C81, C82, C83, C84 |
| 2 | GRM21BC8YA106KE11L 10uF muRata(村田) | C0805 | C85, C87 |
| 4 | CL05B104KO5NNNC 100nF SAMSUNG(三星) | C0402 | C86, C88, C89, C92 |
| 2 | 0603X7R103K100NT 10nF AIDE(爱迪电容) | C0603 | C90, C91 |
| 1 | 0805B472K500NT 4.7nF FH(风华) | C0805 | C93 |
| 18 | 10kΩ UNI-ROYAL(Uniroyal Elec) | R_0402 | R1, R2, R13, R14, R18, R19, R23, R24 +10 |
| 1 | 330Ω UNI-ROYAL(Uniroyal Elec) | R_0402 | R3 |
| 8 | 1kΩ UNI-ROYAL(Uniroyal Elec) | R_0402 | R4, R5, R6, R38, R41, R42, R43, R91 |
| 22 | 100Ω UNI-ROYAL(Uniroyal Elec) | R_0402 | R7, R8, R9, R11, R15, R17, R33, R35 +14 |
| 6 | 180Ω UNI-ROYAL(Uniroyal Elec) | R_0603 | R10, R12, R16, R47, R51, R53 |
| 5 | 15kΩ UNI-ROYAL(Uniroyal Elec) | R_0402 | R20, R21, R57, R58, R82 |
| 1 | 10kΩ UNI-ROYAL(Uniroyal Elec) | R_0603 | R22 |
| 4 | 22Ω UNI-ROYAL(Uniroyal Elec) | R_0402 | R28, R29, R31, R32 |
| 2 | 1kΩ UNI-ROYAL(Uniroyal Elec) | R_0603 | R37, R39 |
| 2 | 1206W4F100JT5E 10Ω UNI-ROYAL(厚声) | R1206 | R40, R75 |
| 6 | 4.7kΩ UNI-ROYAL(Uniroyal Elec) | R_0402 | R59, R61, R63, R65, R92, R93 |
| 3 | 1.5kΩ UNI-ROYAL(Uniroyal Elec) | R_0402 | R67, R79, R80 |
| 1 | 976kΩ | R_0805_2012Metric | R72 |
| 1 | 100kΩ UNI-ROYAL(Uniroyal Elec) | R_0603 | R73 |
| 1 | 220kΩ UNI-ROYAL(Uniroyal Elec) | R_0603 | R74 |
| 2 | 12kΩ UNI-ROYAL(Uniroyal Elec) | R0402 | R76, R86 |
| 1 | 20kΩ UNI-ROYAL(Uniroyal Elec) | R0402 | R77 |
| 3 | 2.2kΩ UNI-ROYAL(Uniroyal Elec) | R0402 | R78, R81, R85 |
| 2 | 5.1kΩ UNI-ROYAL(Uniroyal Elec) | R_0402 | R83, R84 |
| 4 | FRC0402F3602TS 36K 1% FOJAN(富捷) | R0402 | R87, R88, R89, R90 |
| 1 | ERJ2GE0R00X 0Ω PANASONIC(松下) | R0402 | R94 |
| 1 | 0805W8F4702T5E 47KΩ UNI-ROYAL(厚声) | R0805 | R95 |
| 2 | AC0805FR-0760R4L 60.4Ω YAGEO(国巨) | R0805 | R96, R97 |
RCM DishControllerBoard design files
The KiCad project lives in the jrseti/RCM_DishControllerBoard repository on GitHub; these links point at the commit this page was built from.
RCM DishControllerBoard: common questions
What microcontroller does the RCM DishControllerBoard use?
The RCM DishControllerBoard is built around the STM32G474RET6, from the STM32 family.
How big is the RCM DishControllerBoard PCB?
The RCM DishControllerBoard measures 140 × 100 mm, has 4 copper layers and is 1.6 mm thick.
How many components are on the RCM DishControllerBoard?
304 components, from 111 distinct parts. The full bill of materials is listed on this page.
Where can I download the RCM DishControllerBoard design files?
From the jrseti/RCM_DishControllerBoard repository on GitHub, which has the KiCad layout and the schematic; the links under Design files point to each one.
Can I use the RCM DishControllerBoard design in my own project?
Yes, under the terms of its MIT license, which jrseti chose for the repository.
Can I test firmware for the RCM DishControllerBoard without the hardware?
Yes. HardLabs builds a simulation of the board from its netlist and BOM, so you can run and debug STM32 firmware against it before you order a PCB.
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